Flexible display panel and flexible display device

Abstract

The invention discloses a flexible display panel and a flexible display device, and relates to the technical field of display. The flexible display panel comprises a flexible substrate, and the flexible substrate comprises a first flexible layer, a first inorganic layer and a second flexible layer which are arranged in sequence; the flexible substrate is divided into a display region and a non-display region surrounding the display region, the display region comprises a drive function layer and a light-emitting layer, the non-display region comprises a first region and at least two grooves, wherein the first region comprises a signal lead, a first buffering layer and a first packaging layer which are arranged in sequence, the grooves are located in the non-display region, the extending direction of the grooves is the same as that of the signal lead, the grooves penetrate through the second flexible layer and the first buffering layer, and the first packaging layer makes contact with the first inorganic layer through the grooves; in the first region, an annular closed space is formed by the first packaging layer and the first inorganic layer on the section vertical to the signal lead extending direction, and the signal lead is located in the closed space, which is beneficial for improving ageing resistance of the flexible display panel.

Description

technical field [0001] The present application relates to the field of display technology, in particular, to a flexible display panel and a flexible display device. Background technique [0002] As panel displays are more and more widely used, widescreen technology has become an important technical item. At the same time, the technology of narrow lower borders of display panels is also becoming more and more important. Advanced electronic products, especially portable electronic products, tend to be smaller in size. COF (chip on flexible, flexible chip) technology is an important technology to realize the miniaturization of electronic products. The so-called COF technology refers to designing the driver chip IC in a flexible material to form an FPC (Flexible Printed Circuit) integrated with the IC, and then folding the FPC to the back of the display panel, thereby realizing the miniaturization of the entire display device. [0003] figure 1 Shown is a schematic diagram of...

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Problems solved by technology

However, considering that the inorganic layer has the function of blocking moisture and oxygen, when the inorganic layer in the bending area is removed, moisture and oxygen can easily enter the area where the wiring 303 is located from the flexible substrate 302, and the wiring 303 is in contact with moisture and oxygen. Afterwards, the aging will be accelerated, thereby reducing the anti-aging performance of the entire flexible display panel 300 and reducing the service life of the flexible display panel 300

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