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Circuit element package, manufacturing method and manufacturing device thereof

A technology of circuit components and printed circuit boards, applied in the direction of circuit devices, printed circuit manufacturing, electrical components, etc., can solve the problems of electromagnetic shielding performance degradation and other issues

Active Publication Date: 2020-06-12
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such thermal vias cause deterioration of electromagnetic shielding performance

Method used

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  • Circuit element package, manufacturing method and manufacturing device thereof
  • Circuit element package, manufacturing method and manufacturing device thereof
  • Circuit element package, manufacturing method and manufacturing device thereof

Examples

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Embodiment Construction

[0066] Exemplary embodiments are described in more detail below with reference to the accompanying drawings.

[0067] In the following description, the same reference numerals are used for the same elements even in different drawings. Matters such as detailed construction and elements defined in the specification are provided to assist in a comprehensive understanding of the exemplary embodiments. However, it is apparent that the exemplary embodiments can be practiced without those specifically limited matters. Also, well-known functions or constructions may not be described in detail since they would obscure the description with unnecessary detail.

[0068] It will be understood that the terms "comprising" and / or "comprising" as used herein indicate the presence of stated features or components, but do not exclude the presence or addition of one or more other features or components. Also, terms such as "unit," "device," and "module" described in this specification refer to ...

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Abstract

Provided are a circuit element package, its manufacturing method and its manufacturing device. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering side surfaces of the insulating layer, and a first shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer. Two shielding layers.

Description

technical field [0001] Apparatuses and methods consistent with the exemplary embodiments relate to a circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof, and more particularly, to a device having an electromagnetic shielding member capable of protecting a semiconductor chip or a passive element included in the package and capable of shielding electromagnetic waves. Circuit element package, its manufacturing method and its manufacturing device. Background technique [0002] Recently, the demand for portable devices has suddenly increased in the electronic product market, and due to this, miniaturization and weight reduction of electronic components mounted on such electronic products are continuously occurring. In order to achieve miniaturization and weight reduction of electronic parts, not only a technology capable of reducing the individual size of mounted parts but also a semiconductor packaging technology capable of integrating ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/552
CPCH01L23/552H01L24/13H01L24/16H01L2224/131H01L2224/16227H01L2924/19043H01L2924/19042H01L2924/19041H01L2924/19105H01L2924/014H01L2924/00014H01L2924/181H01L23/24H05K1/0218H05K3/284H05K2201/0715H05K2203/0126H05K2203/1316B05B15/20H01L2924/3025H01L23/49838H01L2924/00012
Inventor 鞠健高英大白五贤韩银奉金贤香郑然璟文溢柱
Owner SAMSUNG ELECTRONICS CO LTD