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Material transmission method and device on equipment, and material transmission equipment

A transmission method and material transmission technology, applied in the field of industrial processing, can solve the problems of not considering other nodes of the equipment, only considering the starting node and termination node, and not taking it into account, so as to reduce human risks and reduce operational complexity.

Active Publication Date: 2020-04-28
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, when the current APCVD equipment uses algorithms to calculate the transmission path of materials for making chips, it often only considers the starting node and end node when transmitting materials, and does not consider other nodes on the equipment. However, in practical applications, for materials The accuracy of each node usually must pass through a certain node on the device, but the current transmission path calculation does not take this into account, so it cannot meet the demand.

Method used

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  • Material transmission method and device on equipment, and material transmission equipment
  • Material transmission method and device on equipment, and material transmission equipment
  • Material transmission method and device on equipment, and material transmission equipment

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Embodiment Construction

[0082] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0083] Taking APCVD equipment as an example, the problems existing in the current equipment are explained. refer to figure 1 A schematic diagram of an APCVD equipment structure is shown, and the APCVD equipment structure is specifically as follows:

[0084] 1. Two LoadPorts, namely LoadPortA and LoadPortB, which have 25 slots, and the materials stored in them include three types of 5 inches, 6 inches and 8 inches;

[0085] 2. One LoadLock can place one piece of material;

[0086] 3. An ExternalValve, located between LoadPort and LoadLock;

[0087] 4. One TC chamber;

[0088] 5. An InternalValve, located between LoadLock and TC;

[0089] 6. A process chamber for performing corresponding process operations. For materials of di...

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Abstract

The embodiment of the invention provides a conveying method and device for materials on equipment. The conveying method comprises the steps that the starting node and the final node of conveying of the materials on the equipment are determined; whether an inevitable node exists between the starting node and the final node is judged; if yes, according to the inevitable node, the starting node and the final node, the conveying path is calculated; if not, the conveying path is calculated through the starting node and the final node; and the materials are conveyed on the equipment through the conveying path. According to the conveying method and device, configuration is conducted in advance in practice, the inevitable node is designated, when manual piece conveying is needed, a system of the equipment calculates the conveying path sectionally and automatically according to the inevitable node, conveying can be completed through one time of operation, operation complexity is reduced, and human risks are lowered.

Description

technical field [0001] The invention relates to the technical field of industrial processing, in particular to a material transmission method on equipment, a material transmission device on equipment and material transmission equipment. Background technique [0002] CVD (Chemical Vapor Deposition) technology is the main technology used to prepare high-purity, high-performance solid films. In a typical CVD process, one or more vapor source atoms or molecules are mixed in the chamber, and chemical reactions occur under the action of external energy (such as heating, light, plasma, etc.) and form the desired vapor on the surface of the wafer. solid film. Usually, many by-products are also generated during the CVD process, and these by-products are carried away by the gas flow out of the chamber. Due to the advantages of fast growth rate, wide range of film formation, good reproducibility, and epitaxial growth, CVD technology is widely used in various forms of film formation, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G43/00
CPCB65G43/00B65G2203/0266
Inventor 崔琳
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD