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Printed circuit board

A printed circuit board and circuit technology, applied in the field of multi-layer printed circuit board strain testing of printed circuit board components, can solve the problems of easy disconnection of connecting lines, reduced effectiveness of stress testing, and reduced accuracy of test results, etc. The effect of high coverage, improved effectiveness and accuracy

Inactive Publication Date: 2017-12-08
HUAWEI DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the stress test scheme of the PCBA in the prior art still has the following defects: 1) the stress test of the existing PCBA cannot fully cover the entire board, and the effectiveness of the stress test is reduced; 2) the strain gauge is mounted at a local point During the test, it is necessary to eradicate the original components on the PCBA and open up the space for the leads to realize the stress test; and the connection line for mounting the strain gauge is easy to break during the test process, resulting in a decrease in the accuracy of the test results

Method used

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Embodiment Construction

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] The structure of the PCB board described in the embodiment of the present invention is to illustrate the technical solution of the embodiment of the present invention more clearly, and does not constitute a limitation to the technical solution provided by the embodiment of the present invention. The technical solutions provided by the embodiments of the present invention are also applicable to similar technical problems when the scene arises.

[0021] Such as figure 1 as shown,...

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Abstract

The invention relates to the field of a circuit board and provides a printed circuit board (PCB), which is used for carrying out strain test on a printed circuit board assembly (PCBA). The printed circuit board comprises multiple layers of conductive layers and insulating layers for separating the conductive layers. The printed circuit board also comprises strain array layers. Each strain array layer is arranged between the adjacent insulating layers. According to the scheme, the printed circuit board can test the overall stress of the PCB, is high in coverage, realizes test of overall board stress of the PCB and improves stress test effectiveness and accuracy.

Description

technical field [0001] The present invention relates to the field of circuit boards, in particular to the strain testing of a printed circuit board assembly (PCBA) by a multilayer printed circuit board (PCB for short). Background technique [0002] At present, with the increase of the size of the intelligent terminal, but the thickness of the terminal is getting thinner and the number of components in the terminal is increasing, the stress failure problem of the PCBA inside the terminal becomes more and more complicated. The stress specifically refers to the When deformation occurs due to external factors (force, humidity, temperature field changes, etc.), the internal force of interaction is generated between the various parts of the object to resist the effect of this external factor and try to restore the object from the deformed position to its original position. position before deformation. The stress failure specifically means that when the deformation of the device o...

Claims

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Application Information

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IPC IPC(8): G01B7/16G01L1/22
CPCH05K3/46G01B7/20G01L1/22
Inventor 龚云隆
Owner HUAWEI DEVICE CO LTD
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