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Heat radiation bus groove

A busway and positioning slot technology, applied in the electrical field, can solve the problems of lack of busway, hidden danger of fire safety and high cost, and achieve the effect of better effect, greater heat dissipation, and increased heat dissipation area.

Inactive Publication Date: 2017-12-08
江苏传盛电气集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, bus ducts also have some disadvantages. For example, because the speed-collecting arrangement between bus ducts usually generates a lot of heat, the heat dissipation problem of bus ducts has always been a big problem that has plagued bus duct developers. If bus ducts Without the necessary heat dissipation performance, once the high temperature generated by the bus bars in the bus duct cannot be dissipated in time, it is likely to bring fire safety hazards
Heat sinks are usually used for heat dissipation, which is difficult to process and high in cost

Method used

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  • Heat radiation bus groove
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Embodiment Construction

[0015] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0016] Such as figure 1 , 2 As shown, a heat dissipation bus duct includes a housing 1 and several conductors 2 arranged in parallel and at intervals in the housing 1. The housing 1 includes two side plates 3 and covers the upper and lower sides of the side plates. The cover plates 4 at both ends, the cover plate 4 is provided with a positioning groove, the conductor 2 is arranged in the positioning groove, each conductor 2 is covered with a polyester film 5, and the polyester film is covered with a mica tape; The space formed by the side plate 3 and the cover plate 4 is filled with an inorganic fireproof material 6, and a heat dissipation layer is arranged on the side plate 3, and the heat di...

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Abstract

The invention discloses a heat-dissipating bus duct, which comprises a housing and a plurality of conductors arranged in parallel and at intervals in the housing. The housing includes two side plates and cover plates covering the upper and lower ends of the side plates. The cover plate is provided with a positioning groove, the conductor is arranged in the positioning groove, each conductor is covered with a polyester film, and the polyester film is covered with a mica tape; the space formed by the side plate and the cover plate Inorganic fireproof materials are filled in the middle, and heat dissipation layers are arranged on the side plates, and the heat dissipation layers include a number of heat dissipation protrusions, the heat dissipation protrusions are arranged at intervals, and heat dissipation holes are opened on the heat dissipation protrusions, and the side plates A temperature sensor is arranged inside, and an alarm is arranged outside the side plate. The invention has good heat dissipation performance and long service life, and it is not easy to damage the inside when the outside burns, and the busway can still provide normal power supply. The invention can also monitor the temperature of the busway in real time to avoid safety accidents.

Description

technical field [0001] The invention relates to a heat dissipation bus duct, which belongs to the electrical field. Background technique [0002] Modern high-rise buildings and large workshops require huge amounts of electrical energy, and in the face of the huge loads requiring hundreds of thousands of amperes of strong current, safe and reliable conduction equipment must be selected. The busway is a power distribution device for efficient current transmission, especially to meet the needs of economical and reasonable wiring of increasingly taller buildings and large-scale factories. [0003] However, bus ducts also have some disadvantages. For example, because the speed-collecting arrangement between bus ducts usually generates a lot of heat, the heat dissipation problem of bus ducts has always been a big problem that has plagued bus duct developers. If bus ducts Without the necessary heat dissipation performance, once the high temperature generated by the bus bars in the...

Claims

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Application Information

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IPC IPC(8): H02G5/06H02G5/10
CPCH02G5/06H02G5/10
Inventor 栾建华
Owner 江苏传盛电气集团有限公司
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