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Integrated circuit board placing device
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A technology for integrated circuit boards and placing boards, which is applied in packaging, food packaging, transportation and packaging, etc., can solve the problems of easily damaged integrated circuit boards and integrated circuit boards, and achieve the effect of preventing damage
Inactive Publication Date: 2017-12-15
吉林省小鸡奔奔教育科技开发有限公司
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Abstract
Description
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Problems solved by technology
[0006] In order to overcome the shortcomings in the prior art that dust is easy to enter, components on the integrated circuit board are easily damaged when placed, and the integrated circuit board is easy to be damp, the technical problem to be solved by the present invention is to provide a device that is not easy to enter dust, An integrated circuit board placement device that will not damage the components on the integrated circuit board and can prevent the integrated circuit board from getting wet when placed
Method used
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Embodiment 1
[0035] An integrated circuit board placement device such as Figure 1-7 As shown, it includes a first placement plate 1 , a protection mechanism 2 and a placement mechanism 3 , the top of the first placement plate 1 is connected with the protection mechanism 2 , and the protection mechanism 2 is connected with the placement mechanism 3 .
Embodiment 2
[0037] An integrated circuit board placement device such as Figure 1-7 As shown, it includes a first placement plate 1 , a protection mechanism 2 and a placement mechanism 3 , the top of the first placement plate 1 is connected with the protection mechanism 2 , and the protection mechanism 2 is connected with the placement mechanism 3 .
[0038] The protection mechanism 2 includes a first baffle plate 201, a support plate 202, a top plate 203, a first slide rail 204, a first slider 205 and a second placement plate 206, and the left and right sides of the top of the first placement plate 1 are connected with support plates 202, the tops of the support plates 202 on the left and right sides are connected with a top plate 203, the rear walls of the support plates 202 on the left and right sides are connected with a first baffle plate 201, and the insides of the support plates 202 on the left and right sides are evenly connected with a first slide rail 204 , the first sliding blo...
Embodiment 3
[0040] An integrated circuit board placement device such as Figure 1-7 As shown, it includes a first placement plate 1 , a protection mechanism 2 and a placement mechanism 3 , the top of the first placement plate 1 is connected with the protection mechanism 2 , and the protection mechanism 2 is connected with the placement mechanism 3 .
[0041] The protection mechanism 2 includes a first baffle plate 201, a support plate 202, a top plate 203, a first slide rail 204, a first slider 205 and a second placement plate 206, and the left and right sides of the top of the first placement plate 1 are connected with support plates 202, the tops of the support plates 202 on the left and right sides are connected with a top plate 203, the rear walls of the support plates 202 on the left and right sides are connected with a first baffle plate 201, and the insides of the support plates 202 on the left and right sides are evenly connected with a first slide rail 204 , the first sliding blo...
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Abstract
The invention relates to a placing device, in particular to an integrated circuit board placing device. In order to solve the technical problems, the invention provides the integrated circuit board placing device which is not liable to introduce dust, does not damage elements on an integrated circuit board while placed, and can prevent the integrated circuit board from being moisturized. The integrated circuit board placing device comprises a first placing board and the like, wherein the top of the first placing board is connected with a protective mechanism; and a placing mechanism is connected in the protective mechanism. A first baffle plate and a top plate can prevent dust or other impurities from entering an integrated circuit on a second placing board, so that the integrated circuit is prevented from being damaged; a rubber leather sleeve can protect elements on the integrated circuit board, so that the elements are prevented from being damaged in a placing process; and a rotary blade and an electric heating wire which are arranged can prevent the integrated circuit board from being damaged as a result of being moisturized.
Description
technical field [0001] The invention relates to a placement device, in particular to an integrated circuit board placement device. Background technique [0002] An integrated circuit board is a carrier for carrying integrated circuits. But it is often said that the integrated circuit board also brings the integrated circuit. The integrated circuit board is mainly composed of silica gel, so it is generally green. [0003] The newly produced integrated circuit boards are generally placed on the special placement device for the integrated circuit board first, and then stored in the warehouse. However, the current integrated circuit board placement device generally simply packs the integrated circuit board with a transparent plastic bag. Then put it directly into the carton for sealed storage. This kind of placement device is not only easy to enter dust because of the poor sealing of the carton, but also easy to put the integrated circuit board because there is no specific pro...
Claims
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Application Information
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