Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

SMD surface mount support

A SMD, LED chip technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of poor structural stability, easily affected conductive areas, etc., to achieve the effect of simple and practical structure and changing current

Pending Publication Date: 2017-12-15
GUANGDONG LCLED LIGHTING
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional SMD LED lamp beads are usually equipped with a package cavity, which has poor structural stability. It is easy to affect the conductive area after long-term use, and the internal structure has been fixed after packaging. The scope of change has great limitations when using

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • SMD surface mount support
  • SMD surface mount support

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Such as figure 1 As shown, the present embodiment provides a kind of SMD patch support, including plastic base 1, and described plastic base 1 is provided with encapsulation platform and is arranged on the conductive sheet that is used for connecting LED chip on the encapsulation platform, and described encapsulation There are four conductive sheets on the table, and each conductive sheet extends from the inside to the outside along the packaging table to form conductive pins on both sides of the packaging table, and the packaging table is provided with positioning grooves matching the conductive sheets. The conductive sheet is embedded in the positioning groove and is flat with the end surface of the packaging table, and the plastic base 1 is a polymer non-conductive material.

[0015] The conductive sheet that this embodiment adopts is rectangular, with figure 1 As an example, the conductive sheet is divided into the first conductive sheet 2, the second conductive sh...

Embodiment 2

[0018] Such as figure 2 As shown, the difference between this embodiment and Embodiment 1 is that the conductive sheet adopts an L-shaped structure, wherein the L-shaped bottom ends of the first conductive sheet 2 and the second conductive sheet 3 are opposite and divided into one group, and the third conductive sheet 4 Opposite to the L-shaped bottom end of the fourth conductive sheet 5 and divided into another group, the first LED chip 6 is connected to the bottom position between the first conductive sheet 2 and the second conductive sheet 3, and the second LED chip 7 is connected to The bottom position between the second conductive sheet 3 and the fourth conductive sheet 5 . The series-parallel connection mode is the same as the first embodiment.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an SMD surface mount support including a plastic base. The plastic base is provided with a packaging table and conductive sheets arranged on the packaging bench and used for connecting LED chips. The packaging bench is provided with four conductive sheets. The conductive sheets extend from inside to outside along the packaging bench to the two sides outside the packaging bench to form conductive pins. The packaging bench is provided with positioning slots matching the conductive sheets. The conductive sheets are embedded into the positioning slots, and are flush with the end faces of the packaging bench. The SMD surface mount support is simple and practical. After SMD lamp beads are formed through packaging, series-to-parallel switching can be realized by changing the way of connection between the conductive pins and an external circuit, and thus, the current and voltage required for normal work of the lamp beads can be changed.

Description

technical field [0001] The invention relates to the technical field of SMD packaging, in particular to an SMD patch bracket. Background technique [0002] SMD refers to surface mount devices, and SMD SMD LEDs are surface mount light emitting diodes. SMD patch helps to improve production efficiency and different equipment applications. It is a solid-state semiconductor device that can directly convert electricity into light. The LED bracket is the bottom base of the LED lamp bead before packaging. On the basis of the LED bracket, the chip is fixed in, the positive and negative electrodes are soldered, and then packaged with packaging glue. Traditional SMD LED lamp beads are usually equipped with a package cavity, which has poor structural stability. It is easy to affect the conductive area after long-term use, and the internal structure has been fixed after packaging. The scope of change has great limitations when used. Contents of the invention [0003] In order to solv...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/62H01L33/48
CPCH01L33/48H01L33/62
Inventor 王俊华
Owner GUANGDONG LCLED LIGHTING
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com