Array waveguide grating bilinear temperature compensation device and method
A technology of arrayed waveguide grating and temperature compensation device, which is applied in the field of optical communication and can solve the problems of residual and non-compensation.
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[0060] Such as figure 1 As shown, the device of the present invention includes a first driver 1 and a second driver 2 .
[0061] Such as figure 2 As shown, a specific embodiment is that the first driver 1 includes a driving rod 11, and the two ends of the driving rod 11 are respectively provided with a base 301 and a base 302. The base can be made of, but not limited to, a transparent material with a low expansion coefficient such as quartz, Glass, etc., the connection between the driving rod 11 and the base can be by means of bonding, etc., and the bases 301 and 302 are respectively fixed on the first part w1 and the second part w2 after the AWG chip is divided.
[0062] Such as image 3 As shown, the driving rod 11 of the first driver 1 is equipped with an elastic structure 12, which can produce elastic deformation along the length direction of the driving rod 11; a specific embodiment is that the end surface of the base 302 of the first driver 1 is larger than the end s...
Embodiment 1
[0069] Such as Figure 9 As shown, the driving rod 11 of the first driver 1 has an elastic structure 12 whose length is L 1 The two ends of the driving rod 11 are respectively fixed on the two parts w2 and w1 divided by the AWG chip through the bases 301 and 302, and the driving rod 21 of the second driver 2 is fixed on the second part w2 after the division of the AWG chip through the base 303 , the base 303 of the second driver 2 is disposed on the AWG chip w2 so that one end surface 202 of the second driver 2 is in contact with the force bearing surface m of the first driver 1 . The length L of the driving rod 21 of the second driver 2 2 Set to be less than the length L of the first drive 1 drive rod 11 1 , the driving rod 11 of the first driver 1 and the driving rod 21 of the second driver 2 adopt the same material.
[0070] Such as Figure 14 As shown, when the temperature and wavelength of the AWG chip are fully compensated, the relative displacement per unit temperat...
Embodiment 2
[0087] The length L of the first driver 1 driving rod 11 and the second driver 2 driving rod 21 1 , L 2 The setting can be contrary to Embodiment 1, the length of the first driver 1 driving rod 11 is less than the length of the second driver 2 driving rod 21; when the temperature decreases, due to the length L of the second driver 2 driving rod 21 2 greater than the length L of the drive rod 11 of the first drive 1 1 , the linear expansion coefficients of the driving rods of the first driver 1 and the second driver 2 are the same, so the shrinkage of the second driver 2 per unit temperature k 2 Greater than the amount of shrinkage k per unit temperature of the first driver 1 1 , so that the end surface 202 of the second driver 2 is separated from the stressed end surface m of the first driver 1, the first driver 1 pulls the AWG chip w1 through the base 302 to move a distance of 0.9α, and the compensation curve is as follows Figure 14 curve a D , the length L of the second...
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