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Grinding jig for regular-polygon wafer grinding

A regular polygon and star wheel technology, applied in the field of star wheels, can solve the problems of unfavorable production, increased production costs, low utilization rate of star wheels, etc., and achieve the effect of improving versatility and facilitating production and processing

Pending Publication Date: 2017-12-26
德清凯晶光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The opening position of the traditional star wheel is fixed, so that the same star wheel can only be clamped for the crystal of the same shape, resulting in low utilization rate of the star wheel and increased production cost
For example, the authorized announcement number is CN202804917U, which discloses a star wheel for grinding quartz wafers, which can only process wafers of a fixed size. If other sizes of wafers need to be processed, the star wheel must be replaced, which is not conducive to Production

Method used

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  • Grinding jig for regular-polygon wafer grinding
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  • Grinding jig for regular-polygon wafer grinding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] according to Figure 1 ~ Figure 2 As shown, a planetary wheel for regular polygonal wafer grinding includes: a concentrically arranged base tooth disc 1 and a rotary ring 2, the outer ring of the base tooth disc 1 is provided with teeth, and the inner circumference of the base tooth disc 1 Evenly distributed with some regular polygonal holes 11, the regular polygonal holes 11 described in the present embodiment are regular triangular holes, each vertex of the regular polygonal holes 11 is provided with a clamping bar 12, and the clamping bar 12 is provided with There is a chute 121, and a buckle column 13 is arranged in the chute 121, and the clamp rod 12 on the adjacent top corner is connected to the buckle column 13 through the chute 121, and the adjacent buckle column 13 A tension spring 14 is arranged between them, the number of the clamp rod 12, the buckle column 13 and the tension spring 14 is three, and the swivel 2 is connected to one buckle column 13 through a ...

Embodiment 2

[0027] The difference from the above-mentioned embodiment 1 is that, according to figure 2 , Figure 4 As shown, the movable head 123 is provided with a guide rod 124, the regular polygonal hole 11 is provided with a circular groove 15, the guide rod 124 is buckled in the circular groove 15, and the circular groove 15 There is a one-to-one correspondence with the clamping rods 12 . Thereby improving the gripping performance.

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Abstract

The invention relates to the field of wafer grinding, in particular to a grinding jig for regular-polygon wafer grinding. The grinding jig comprises a base fluted disc and a rotary ring which are arranged in a concentric mode. Teeth are arranged on the outer ring of the base fluted disc, a plurality of regular-polygon holes are circumferentially and uniformly distributed in the base fluted disc, clamping bars are arranged at the vertexes of each regular-polygon hole, sliding grooves are formed in the clamping bars, buckle columns are arranged in the sliding grooves, the clamping bars at the adjacent vertexes are connected with the buckle columns through the sliding grooves, the number of the buckle columns and the number of the clamping bars are the same and are both equal to the number of sides of the polygons, and tension springs are arranged between the adjacent buckle columns. The rotary ring is connected with one buckle column on each regular-polygon hole through a connecting bar and is inserted in the center of the base fluted disc in a buckled mode.

Description

technical field [0001] The invention relates to the field of wafer grinding, in particular to a star wheel for grinding regular polygonal wafers. Background technique [0002] In the production process of optical wafers, the grinding process is a very important link. Among them, the double-sided grinding machine is mainly used for double-sided grinding of crystal parts with two parallel sides, and the crystal is clamped by a star wheel. The opening position of the traditional star wheel is fixed, so that the same star wheel can only clamp the crystal of the same shape, resulting in low utilization rate of the star wheel and increased production cost. For example, the authorized announcement number is CN202804917U, which discloses a star wheel for grinding quartz wafers, which can only process wafers of a fixed size. If other sizes of wafers need to be processed, the star wheel must be replaced, which is not conducive to Production. Contents of the invention [0003] The...

Claims

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Application Information

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IPC IPC(8): B24B37/27
CPCB24B37/27
Inventor 沈斌斌
Owner 德清凯晶光电科技有限公司