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Plasma Processing Apparatus

A processing device and plasma technology, which are applied in the fields of plasma, semiconductor/solid-state device manufacturing, discharge tubes, etc., can solve the problems of limited service life of window plates, easy damage, and the peripheral area of ​​holes is easily damaged by micronization.

Active Publication Date: 2017-12-29
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Here, the aperture peripheral region of the window plate, including the nozzle, is structurally vulnerable compared to other regions of the window plate, thereby causing micronization due to plasma damage
Specifically, when the window plate is reused after it has been cleaned by a chemical cleaner or after the window plate has been polished, the hole peripheral region of the window plate is exposed to plasma to accelerate its degradation, and thus, the hole peripheral region is susceptible to particles chemical damage
In addition, depending on the number of times the window panel is cleaned, the service life of the window panel is limited
[0004] Generally, the process gas is injected in the vertical direction through the nozzle, and the mixing power of the process gas is smaller in the lower pressure zone inside the chamber, which leads to an uneven distribution of the process gas in the edge zone of the wafer
Therefore, it causes problems such as lower product yield

Method used

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  • Plasma Processing Apparatus
  • Plasma Processing Apparatus
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Examples

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Embodiment Construction

[0025] refer to figure 1 , a plasma processing apparatus according to an example embodiment is described below. figure 1 is a cross-sectional view schematically showing a plasma processing apparatus according to an example embodiment.

[0026] refer to figure 1 , the plasma processing apparatus 10 according to an example embodiment may process the wafer W using plasma. For example, an etching process for wafer W may be performed. The plasma processing apparatus 10 may include a chamber 100 , a window plate 200 , an injector 300 and a stopper 400 .

[0027] The chamber 100 may define or provide an inner space 110 in which a processing process for the wafer W is performed. Chamber 100 may be formed of, for example, a solid material such as metal.

[0028] A supporter 120 on which a wafer W for manufacturing a semiconductor device is disposed may be disposed at or in a lower portion of the internal space 110 . The support 120 may include, for example, an electrostatic chuck...

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Abstract

The invention provides a plasma processing apparatus. The plasma processing apparatus includes a chamber, a window plate disposed in an upper portion of the chamber and having a fastening hole defined therein, an injector having a body part including a plurality of nozzles and configured to be fastened to the fastening hole, and a flange part extending radially from the body part to partially cover a bottom surface of the window plate when the body part is fastened to the fastening hole, and a stopper configured to be fastened to the body part on an upper surface of the window plate to hold the injector in the fastening hole when the body part is fastened to the fastening hole.

Description

technical field [0001] The inventive concept relates to a plasma processing apparatus. Background technique [0002] Plasma processing apparatuses are generally used in the manufacture of semiconductor devices, light emitting diodes (LEDs), liquid crystal displays (LCDs), and the like. Among them, the ICP type etching device includes a hole at the center of the window plate, an RF power transmission path, and a nozzle installed in the hole to inject process gas into the chamber. A process gas is excited into a plasma state within the chamber and collides with an etching target (eg, a wafer) to perform an etching process. [0003] Here, the aperture peripheral region of the window plate, including the nozzle, is structurally vulnerable compared to the other regions of the window plate, thereby causing microparticles due to plasma damage. Specifically, when the window plate is reused after it has been cleaned by a chemical cleaner or after the window plate has been polished,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
CPCH01J37/3244H01J37/32449H01J37/32119H01J37/321H01J2237/334H01J37/32458H01L21/67069
Inventor 金学泳洪定杓宣钟宇成德镛林龙浩全允珖郑和俊
Owner SAMSUNG ELECTRONICS CO LTD