Case provided with cooling cavity
A heat dissipation cavity and chassis technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of low heat dissipation efficiency and weak controllability, achieve high heat dissipation efficiency, strong controllability, and improve utilization efficiency Effect
Inactive Publication Date: 2018-01-05
区楠霜
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Problems solved by technology
Although this design allows the chassis power supply to form an independent heat dissipation system, so that the power supply can reduce its own temperature through more cold air from the outside, but it still has the following defects: the heat dissipation of this design belongs to passive heat dissipation, not Immediate response based on temperature conditions, low heat dissipation efficiency, and weak control
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Embodiment Construction
[0018] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.
[0019] see figure 1 – figure 2 , a case provided with a cooling cavity, comprising a case body 1, a main board 2, an optical drive 3 and a power supply 7, the main board 2 is arranged in the middle of the case body 1, the right side of the main board 2 is connected to the left side of the optical drive 3, The right side of the optical drive 3 is connected to the right wall of the cabinet 1, and a power supply 7 is provided at the intersection of the left wall and the bottom wall of the cabinet 1;
[0020] The chassis also includes a cooling fan 5 and a controller 6; a cooling chamber 11 is arranged below the bottom wall of the casing 1, and a dust cover 4 is arranged below the cooling chamber 11, and the cooling fan arranged in the cooling chamber 11 The fixed end of 5 is connected with the bottom surface of the bottom wall of the ...
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The invention discloses a case provided with a cooling cavity. The case comprises a case body, a mainboard, an optical disk driver, a power source, a cooling fan and a controller, wherein the mainboard is arranged in the middle of the case body, the right side of the mainboard is connected with the left side of the optical disk driver, the right side of the optical disk driver is connected with the right wall of the case body, the power source is arranged at the joint of the left wall and the bottom wall of the case body, the cooling cavity is arranged below the bottom wall of the case body, adust cover is arranged below the cooling cavity, the fixed end of the cooling fan arranged in the cooling cavity is connected with the bottom face of the bottom wall of the case body, the top face ofthe bottom wall of the case body is connected with the controller, and the cooling fan is connected with a power circuit through the controller. The controller comprises an insulating shell, an inputpower line, an output power line, an electrifying plate, a left temperature-sensing plate, a right temperature-sensing plate, a left conducting plate and a right conducting plate. Through the design,cooling efficiency is high, and controllability is high.
Description
technical field [0001] The invention relates to a computer hardware arrangement, in particular to a chassis provided with a heat dissipation cavity, which is particularly suitable for improving heat dissipation efficiency and enhancing controllability. Background technique [0002] At present, the application range of computers (computers) in our country is getting wider and wider, and the application time is getting longer and longer, and its heat dissipation problem is also prominent. The key components of the computer are basically located in the chassis. With the operation of these components, a large amount of heat will be generated. In addition, if the dust accumulated in the chassis cannot be dissipated in time, high temperature will easily be generated in the chassis. High temperature will not only reduce the operating efficiency of components , and will damage components, thereby reducing the operating life of the chassis, and even cause accidents. [0003] Chinese...
Claims
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IPC IPC(8): G06F1/18G06F1/20
Inventor 区楠霜
Owner 区楠霜