Multi-wire cutting automatic locating equipment for magnetic material
A multi-line cutting and automatic positioning technology, applied in metal sawing equipment, stone processing equipment, metal processing equipment and other directions, can solve the problem of wrong positioning of magnetic material blanks, reduce production costs, improve product qualification rate and product quality The effect of quality and labor cost saving
Inactive Publication Date: 2018-01-12
ZHEJIANG RONGCHUANG MAGNETIC IND
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Problems solved by technology
[0003] In view of the above-mentioned existing technical problems, the present invention proposes an automatic positioning device for multi-wire cutting of magnetic materials; it improves the accuracy and positioning efficiency of magnetic materials in the blank positioning operation, and improves the number of pieces and product output during the cutting operation of the cutting machine tool. Qualification rate; reduce the cost and waste of traditional manual operation, and solve the problem of manual rough measurement of the positioning error of the magnetic material blank. Automatic positioning equipment
Method used
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[0014] The embodiments of the present invention are described in detail below. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following implementation example.
[0015] The following examples are attached figure 1 , 2 A schematic diagram of the structure of the multi-wire cutting automatic positioning equipment for magnetic materials of the present invention is shown as an example for implementation:
[0016] Before the multi-wire cutting process, the magnetic material green body must be neatly placed in a certain orientation and bonded to the asbestos board; the asbestos board is placed on the standard platform 4, and the upper left corner is aligned with the standard right-angle area I12; according to the size of the green body Set the horizontal X-axis and vertical Y-a...
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The invention discloses multi-wire cutting automatic locating equipment for magnetic material. The equipment comprises a machine body, an electric control device, a touch screen, a hand control device, a locating device, an X-axis track control device, a Y-axis bidirectional track control device and a standard platform. The standard platform is arranged at the upper end part of the machine body. The touch screen, the hand control device, the locating device, the X-axis track control device and the Y-axis bidirectional track control device are located on the standard platform. The electric control device is disposed at the lower part of the machine body. The touch screen electrically controls the locating device through an X-axis home position-returning near-point switch and a Y-axis home position-returning near-point switch. The electric control device is electrically connected with the X-axis track control device and the Y-axis bidirectional track control device through the hand control device. While magnetic material is used for automatic green body location of a multi-wire cutting machine tool, labor cost is saved and production efficiency is ensured. While production cost is lowered, product qualification rate and product quality are greatly improved.
Description
technical field [0001] The invention relates to the positioning of multi-wire cutting of magnetic materials, in particular to an automatic positioning device for multi-wire cutting of magnetic materials. Background technique [0002] Multiple wire cutting machine (Multiple wire cutter, Multiple wire cutting machine) is to use a slender diamond wire to wind multiple turns on the machine tool sheave as the cutting wire, and the sheave drives the diamond wire evenly wound on it to do high-speed reciprocating motion. The cutting fluid is sprayed into the processing area, and the cutting line is used to grind the workpiece to achieve grinding and cutting of the workpiece; the multi-wire cutting technology is mostly used for cutting brittle and hard materials such as semiconductor wafers and optical glass, with less cutting loss between chips, The surface damage layer is shallow, the roughness is small, the slice processing rate is high, the production efficiency is high, and the ...
Claims
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IPC IPC(8): B28D5/04B28D7/00B24B27/06B23D61/18
Inventor 徐益明徐海银钱奕乕谢国荣黄振飞任美军叶中秋邵迪
Owner ZHEJIANG RONGCHUANG MAGNETIC IND