Method for detecting atmosphere of technological chamber, and wafer processing equipment

A detection method and process room technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of price increase, chip scrapping, expensive residual gas analyzer, etc., and achieve the effect of simplifying detection steps and reducing costs

Active Publication Date: 2018-01-16
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

[0004] However, a residual gas analyzer equipped with a vacuum pump system is much more expensive than a residual gas analyzer not equipped with this system. If a set of process equipment is usually equipped with multiple process chambers, the price of the complete set of equipment may increase several times
Moreover, the r

Method used

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  • Method for detecting atmosphere of technological chamber, and wafer processing equipment

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Embodiment Construction

[0025] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0026] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0027] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0028] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a method for detecting the atmosphere of a technological chamber, and wafer processing equipment. The method comprises the steps: removing a wafer in the technological chamber;closing a valve of the technological chamber, and reducing the indoor air pressure till the indoor air pressure is lower than specific working pressure; starting a residual gas analyzer for detectingthe indoor atmosphere; enabling the residual gas analyzer to stop working if the indoor atmosphere is normal, and opening the valve of the technological chamber to wait for the entry of the wafer; enabling the residual gas analyzer to stop working if the indoor atmosphere is abnormal, and giving an abnormality alarm. The method reduces the processing cost of the wafer.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a process chamber atmosphere detection method and wafer processing equipment. Background technique [0002] As the size of semiconductor transistors continues to shrink, physical vapor deposition (PVD) and sputtering deposition techniques have become the most widely used thin film fabrication techniques in this field. Taking the PVD preparation process of "copper barrier layer and seed layer" as an example, the process usually includes 4 steps: 1. Degassing process; 2. Pre-cleaning process; 3. Copper barrier layer process; 4. Same seed layer craft. These processing steps are usually carried out in the process chamber, so monitoring the furnace pressure and vacuum degree in the process chamber is the key to realize the above processing steps. [0003] In the prior art, using a residual gas analyzer (RGA) to monitor the furnace atmosphere in the proce...

Claims

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Application Information

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IPC IPC(8): H01L21/67
Inventor 杨洋
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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