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Process chamber atmosphere detection method and wafer processing equipment

A technology for wafer processing and process chambers, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of price increase, wafer scrapping, expensive residual gas analyzer, etc., and achieve the effect of reducing costs and simplifying detection steps

Active Publication Date: 2022-05-27
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Description
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AI Technical Summary

Problems solved by technology

[0004] However, a residual gas analyzer equipped with a vacuum pump system is much more expensive than a residual gas analyzer not equipped with this system. If a set of process equipment is usually equipped with multiple process chambers, the price of the complete set of equipment may increase several times
Moreover, the residual gas analyzer is used to monitor the furnace atmosphere in the process chamber throughout the process. Once an abnormality is found, the process will be suspended and an alarm will be issued. Process suspension will lead to the scrapping of the wafers in process, thus affecting the entire process line. work process

Method used

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  • Process chamber atmosphere detection method and wafer processing equipment

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Embodiment Construction

[0025] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0026] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0027] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0028] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a process room atmosphere detection method and wafer processing equipment. The process chamber atmosphere detection method includes: removing the wafer in the process chamber; closing the valve of the process chamber to reduce the indoor air pressure below the specified working pressure; starting the residual gas analyzer to detect the indoor atmosphere; if the indoor atmosphere is normal, then The residual gas analyzer stops working, opens the valve of the process room, and waits for the wafer to enter; if the indoor atmosphere is abnormal, the residual gas analyzer stops working and an abnormal alarm is issued. The method provided by the invention reduces the cost of wafer processing.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a process chamber atmosphere detection method and wafer processing equipment. Background technique [0002] As the size of semiconductor transistors continues to shrink, physical vapor deposition (PVD) and sputtering deposition techniques have become the most widely used thin film fabrication techniques in this field. Taking the PVD preparation process of "copper barrier layer and seed layer" as an example, the process usually includes 4 steps: 1. Degassing process; 2. Pre-cleaning process; 3. Copper barrier layer process; 4. Same seed layer craft. These processing steps are usually carried out in the process chamber, so monitoring the furnace pressure and vacuum degree in the process chamber is the key to realize the above processing steps. [0003] In the prior art, using a residual gas analyzer (RGA) to monitor the furnace atmosphere in the proce...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
Inventor 杨洋
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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