Optical sensor package module and camera module

Abstract

The invention provides an optical sensor package module whose structure is improved and which can use an absorption filter in a filter, and a camera module. The optical sensor package module comprisesan optical sensor chip, a printed circuit board, a sealing ring and a filter, wherein the optical sensor chip is used for converting an optical image to electric signals; the printed circuit board comprises an opening part formed in a through mode along a vertical direction in the center part and a peripheral part surrounding the opening part, and is located on the optical sensor chip in a mode of overlapping between at least one part of the peripheral part and the optical sensor chip; the sealing ring is located between the optical sensor chip and the printed circuit board to be joined withthe optical sensor chip and the printed circuit board; and the filter enables light to pass through, is located on the printed circuit board and covers the opening part and is joined with the peripheral part. Thus, the structure is improved, and the absorption filter can be used as a filter.

Description

technical field [0001] The present invention relates to an optical sensor package module and a camera module, and more specifically, relates to an optical sensor package module and a camera module whose structures are improved by increasing bonding strength. Background technique [0002] Optical sensor chips are semiconductor elements that have the function of capturing images of objects, and are produced in packaged modules and mounted in mobile devices such as digital cameras and smartphones. [0003] For example, as shown in Korean Registered Patent Publication No. 10-0466243 and Korean Registered Patent Publication No. 10-0730726, conventional package modules have the following components: a glass substrate to form electrical wiring; an optical sensor chip to be flip-chip Chip bonding (flip chip bonding) is bonded to the central portion of the lower side of the glass substrate; solder balls are bonded to the peripheral portion of the lower side of the glass substrate; G...

AI Technical Summary

Problems solved by technology

Therefore, conventional package modules using reflective filters have problems such as flare and color shading.

[0006] On the contrary, compared with the reflective filter, the absorbing filter has relatively few characteristics depending on the incident angle of the incident light, but it is difficult to integrate it into the conventional structure of the package module because of its weak strength used as a filter in

[0007] As described above, conventional package modules have the problem that a relatively reflective filter cannot be used against the glass substrate due to the structural limit of the strength (strength) of the glass substrate to which the absorbing filter with relatively excellent optical characteristics cannot be applied. Brittleness absorbing filters such as blue filter and blue glass are used as filters

Images