A kind of wafer inspection method

Abstract

The invention provides a wafer detection method used for detecting defect of a wafer. The wafer detection method comprises the steps of judging a type of a detection region corresponding to a currentstation in the wafer; judging whether detection of a first region is completed or not if the detection region is the first detection region, if yes, existing, otherwise executing detection on the first region to obtain a first defect detection result; judging whether the first defect detection result is larger than a first preset value or not, if yes, recording that a current wafer is unqualified;judging whether detection of a second detection region is completed or not if the detection region is the second detection region, and exiting if the detection of the second detection region is completed; detecting the second detection region to obtain a second defect detection result if the detection of the second detection region is not completed; and judging whether the second detect detectionresult is larger than a second preset value or not, if yes, recording that the current wafer is unqualified, otherwise recording that the current wafer is unqualified and exiting. The wafer detectionmethod has the beneficial effects that the detection efficiency is improved, and the detection time is saved.

Description

technical field [0001] The invention relates to the field of semiconductor detection, in particular to a wafer detection method. Background technique [0002] At this stage, flash memory devices occupy a large proportion of semiconductor wafers. The structure of memory devices includes storage areas and logic areas. Among them, the storage area is widely distributed and occupies a large proportion of the entire internal structure of the wafer, and the rest is relatively small. The area is the logical area, which has a simpler structure and fewer defects than the storage area. Therefore, when inspecting wafer defects of memory devices, the storage area as the key inspection area will be subjected to enhanced scanning, while the logic area will be inspected in a general defect inspection mode. The existing detection methods have the following problems. For example, when the detection of the storage area or the logic area is performed, when the defect exceeds the standard valu...

AI Technical Summary

Problems solved by technology

The existing detection methods have the following problems. For example, when the detection of the storage area or the logic area is performed, when the defect exceeds the standard value, it is necessary to re-scan the storage area and the logic area in the storage device to analyze the logic area. Therefore, there is a problem that the detection time takes a long time and affects the detection efficiency

Images