Case with inlet air temperature control function

Abstract

The invention discloses a case with an inlet air temperature control function. The case comprises a case body, a mainboard, a driver, a cooling fan, a controller and a power supply, wherein the mainboard is arranged on a backboard of the case body and connected with the driver; the driver is connected with a right side plate of the case body; the power supply is arranged at the joint of a left side plate and a bottom plate of the case body; the cooling fan is arranged at a part, over against the mainboard, of the left side plate of the case body; the controller is arranged at a part, close tothe power supply, of the left side plate of the case body; the controller is arranged to be lower than the cooling fan; the cooling fan is in circuit connection with the power supply via the controller; and the controller comprises a metal shell, an input power line, an output power line, a fixed beam, a rotary beam, a movable conductive sheet, a fixed conductive sheet and a wax block. The case isrelatively high in cooling efficiency and relatively good in controllability.

Description

technical field [0001] The invention relates to a computer hardware configuration, in particular to a case with air intake and temperature control, which is particularly suitable for improving heat dissipation efficiency and enhancing controllability. Background technique [0002] At present, the application range of computers (computers) in our country is getting wider and wider, and the application time is getting longer and longer, and its heat dissipation problem is also prominent. The key components of the computer are basically located in the chassis. With the operation of these components, a large amount of heat will be generated. In addition, if the dust accumulated in the chassis cannot be dissipated in time, high temperature will easily be generated in the chassis. High temperature will not only reduce the operating efficiency of components , and will damage components, thereby reducing the operating life of the chassis, and even cause accidents. [0003] Chinese ...

AI Technical Summary

Problems solved by technology

Although this design allows the chassis power supply to form an independent heat dissipation system, so that the power supply can reduce its own temperature through more cold air from the outside, but it still has the following defects: the heat dissipation of this design belongs to passive heat dissipation, not Immediate response based on temperature conditions, low heat dissipation efficiency, and weak control

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