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Differential Condenser Microphone with Dual Diaphragms

A differential capacitor and dual-diaphragm technology, which is applied in the field of differential capacitor microphones, can solve the problems of low cost, reliability, signal-to-noise ratio drop, and sensitivity drop, and achieve the goals of improving reliability, avoiding internal stress, and maintaining consistent compliance Effect

Active Publication Date: 2020-02-18
MEMSENSING MICROSYST SUZHOU CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the technical development of capacitive micro-silicon microphones, silicon microphones are required to be smaller in size, lower in cost, and higher in reliability, and the smaller size of silicon microphones will lead to a decrease in sensitivity and a decrease in signal-to-noise ratio

Method used

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  • Differential Condenser Microphone with Dual Diaphragms
  • Differential Condenser Microphone with Dual Diaphragms
  • Differential Condenser Microphone with Dual Diaphragms

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Embodiment Construction

[0027] The specific implementation of the differential capacitive microphone with dual diaphragms provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0028] Please refer to figure 1 and figure 2 , is a schematic cross-sectional view of a differential condenser microphone with dual diaphragms according to a specific embodiment of the present invention.

[0029] The differential condenser microphone with dual diaphragms includes: a substrate 100 with a back cavity 101; a first vibrating membrane 200 suspended above the back cavity 101 of the substrate 100, and the first vibrating membrane 200 is insulated Supported on the surface of the substrate 100; the back plate 300 located above the first vibrating membrane 200, the back plate 300 is insulated and supported on the surface of the first vibrating membrane 200, the back plate 300 and the first vibrating membrane The membrane 200 constitutes a first variable capa...

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Abstract

A differential condenser microphone with dual diaphragms, comprising: a back plate; a first vibrating film, which is insulated and supported on the first surface of the back plate, and the back plate and the first vibrating film form a first variable capacitance The second vibrating film is insulated and supported on the second surface of the back plate, and the back plate and the second vibrating film form a second variable capacitor; it is characterized in that: the back plate has at least one connection hole; The second vibrating film has a recessed portion recessed toward the back plate, and the recessed portion passes through the connection hole and is insulatedly connected with the first vibrating film. The aforementioned differential condenser microphone with dual diaphragms has a higher signal-to-noise ratio.

Description

technical field [0001] The invention relates to the technical field of silicon microphones, in particular to a differential capacitive microphone with double diaphragms. Background technique [0002] MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) technology is a high-tech that has developed rapidly in recent years. It uses advanced semiconductor manufacturing technology to realize batch manufacturing of sensors, drivers and other devices. Compared with the corresponding traditional devices , MEMS devices have very obvious advantages in terms of volume, power consumption, weight and price. In the market, the main application examples of MEMS devices include pressure sensors, accelerometers and silicon microphones. [0003] Silicon microphones manufactured with MEMS technology have considerable advantages over ECM in terms of miniaturization, performance, reliability, environmental tolerance, cost, and mass production capacity, and quickly occupy the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R2201/003H04R1/406H04R2209/026H04R19/005H04R7/04
Inventor 孙恺荣根兰胡维李刚
Owner MEMSENSING MICROSYST SUZHOU CHINA
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