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Tungsten-copper-silver-carbon composite material and preparation method thereof

A composite material and system technology, applied in metal material coating technology, metal processing equipment, liquid chemical plating, etc., to achieve the effects of controllable and precise composition, improved mechanical properties, and low cost

Active Publication Date: 2019-08-23
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] According to the results of the domestic and foreign patents and literatures that have been consulted, it is shown that at present, Ag coating and organic carbon source cracking on the Cu surface are used simultaneously to modify the WC wetting layer on the surface of W particles at the nano interface and the micro-coating of the Cu surface in a fixed area. Add Ag sintering aid layer, and prepare Ag@Cu composite coating powder and Ag@Cu@WC@W composite coating powder at the same time, using Ag@Cu as Cu modification; W is wetted by WC layer nano interface, Then cover Cu and Ag to obtain a W-Cu-Ag-C system composite material with an ideal Cu network structure, and prepare a W-Cu-Ag-C system composite material with a flexural strength of 1050MPa by vacuum or atmosphere sintering report

Method used

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  • Tungsten-copper-silver-carbon composite material and preparation method thereof
  • Tungsten-copper-silver-carbon composite material and preparation method thereof
  • Tungsten-copper-silver-carbon composite material and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0036] In the experiment, the raw material Cu powder has a particle size of 20 μm, and the W powder has a particle size of 10 μm. First, the surface-modified Cu powder is dispersed in distilled water, and a layer of dense Ag is coated on the surface of Cu by electroless plating; the prepared Ag The mass fraction of Cu in the @Cu composite coating powder is 5%, and the mass fraction of Ag is 0.5%. WC@W composite coating powder is prepared by mixing W powder with PVB and debinding; finally, electroless plating is also used The Ag@Cu@WC@W composite powder is prepared on the basis of the WC@W composite coating powder. The mass fraction of Cu in the Ag@Cu@WC@W composite coating powder is 1%, and the mass fraction of WC The fraction is 0.5%, and the mass fraction of Ag is 0.5%. Then, the Ag@Cu@WC@W composite powder and the Ag@Cu composite coating powder are ball milled and mixed uniformly on a ball mill to obtain a uniformly mixed powder, and then mixed The uniform powder is cold-pr...

Embodiment 2

[0045] After surface modification, the Cu powder was dispersed in distilled water, and a layer of dense Ag was coated on the surface of Cu by electroless plating method, and the Ag@Cu@WC@W composite powder was prepared by the same method of electroless plating, where The mass fraction of Cu in the Ag@Cu@WC@W composite coating powder is 5%, the mass fraction of WC is 1%, the mass fraction of Ag is 1%, and the mass fraction of Cu in the Ag@Cu composite coating powder is 15%. %, the mass fraction of Ag is 1%, and the two powders are mixed uniformly by ball milling on a ball mill, and then the uniformly mixed powder is cold-pressed at 300MPa to obtain a green body, wherein the particle size of Cu powder is 20 μm, and the particle size of W powder is The diameter is 10μm; finally put N 2 In the atmosphere, sintering is carried out according to the specified sintering process. The sintering process is 800°C-2h. Specifically, the temperature is raised to 800°C, kept at 800°C for 2h, ...

Embodiment 3

[0054] After surface modification, the Cu powder was dispersed in distilled water, and a layer of dense Ag was coated on the surface of Cu by electroless plating method, and the Ag@Cu@WC@W composite powder was prepared by the same method of electroless plating, where The mass fraction of Cu in the Ag@Cu@WC@W composite coating powder is 0.7%, the mass fraction of WC is 0.6%, the mass fraction of Ag is 0.3%, and the mass fraction of Cu in the Ag@Cu composite coating powder is 10% %, the mass fraction of Ag is 0.6%, and the ball mill is carried out on the ball mill to mix uniformly, and then the uniformly mixed powder is cold-pressed under 100MPa to obtain a green body, wherein the particle size of Cu powder is 20 μm, and the particle size of W powder is 10 μm; finally Put it in an Ar atmosphere and sinter according to the specified sintering process. The sintering process is 700°C-2h. Specifically, the temperature is raised to 700°C, kept at 700°C for 2h, and the temperature is n...

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Abstract

The invention is a preparation method of a tungsten-copper-silver-carbon system composite material, specifically: adopting the method of low-temperature sintering densification and multiple times of chemical coating, cracking the organic carbon source to modify the WC wetting layer at the nano interface on the surface of W powder particles To obtain Ag@Cu@WC@W composite coated powder, add Ag sintering aid layer to obtain Ag@Cu composite coated powder by coating the surface of Cu powder particles in a certain area, and then mix the two powders evenly by ball milling. Then cold press the uniformly mixed powder at 100‑500MPa to obtain a green body, and finally sinter the green body in vacuum or atmosphere to obtain a W‑Cu‑Ag‑C system composite material with high performance and high tungsten content. The preparation method of the present invention is simple and controllable, low in cost, controllable and precise in composition, and can obtain a W-Cu-Ag-C system composite material with high density. The composite material has low cost and excellent comprehensive properties such as electricity, heat and mechanics. features.

Description

technical field [0001] The invention relates to composite materials, especially a high-performance, high-tungsten-content tungsten-copper-silver-carbon system composite material and its low-temperature sintering preparation method. The prepared W-Cu-Ag-C system composite material has hardness ≥ 215HV, Bending strength ≥ 780MPa, thermal conductivity ≥ 198W / (m·K), electrical conductivity ≥ 46.2% IACS. Background technique [0002] Traditional two-phase composite materials are represented by pure metals such as Al, Cu, Invar and Kovar alloys with good thermal conductivity and processability. Although these materials have high thermal conductivity, due to the large thermal expansion coefficient , and the composition is single, the thermal expansion coefficient range of the material is narrow, which is very different from the matching semiconductor material. The large difference in thermal expansion coefficient during use is the main reason for the thermal stress in electronic co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/02B22F3/10C23C18/44C23C18/40
CPCC23C18/1653C23C18/40C23C18/44B22F3/1007B22F2998/10B22F1/17B22F1/16B22F3/02B22F2009/043
Inventor 罗国强李远张联盟沈强张成成张建代洋
Owner WUHAN UNIV OF TECH