A Method for Measuring Thermal Deformation of Chips Based on Scanning Electron Microscope

Abstract

The invention discloses a chip thermal deformation measurement method based on a scanning electron microscope and belongs to the technical field of material performance detection. According to the method, high depth of field and high resolution characteristics of the scanning electron microscope are utilized, and through integration with an in-situ heating device, measurement errors caused by thethermal influence and system distortion are fully considered and corrected; and by utilization of a speckle image after the distortion correction, an in-plane deformation field resulting from the deformation of a chip caused by heating is calculated through a digital image related algorithm. On the basis, micro-nanoscale chip full-field thermal deformation measurement is achieved, and the method is applied in practical engineering.

Description

technical field [0001] The invention belongs to the technical field of material performance detection, and in particular relates to a chip thermal deformation measurement method based on a scanning electron microscope. Background technique [0002] With the continuous progress of the semiconductor industry, micro-electro-mechanical systems (Micro Electro-Mechanical Systems, MEMS) have been greatly developed. MEMS devices are usually packaged and manufactured in the form of chip assemblies. Chip components are usually composed of a variety of different nanomaterials. The elastic modulus and thermal expansion coefficient of the materials are different. Under different loads, humidity and temperature conditions, cracks are prone to occur at the material junctions and lead to chip failure. Especially in the packaging process, there are differences in the thermal expansion coefficients of the materials in each layer. After packaging, there is a large thermal stress and residual ...

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Problems solved by technology

However, since the imaging principle of the scanning electron microscope is different from that of ordinary optical imaging equipment, there are complex distortions in the image; the variable temperature environment will also affect the stability of the scanning electron microscope and bring additional thermal noise; the above factors will reduce the chip Measurement accuracy of thermal deformation

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