Optimal cutting technology of chip capacitor and chip capacitor

Abstract

The invention provides an optimal cutting technology of a chip capacitor and the chip capacitor, and relates to the technical field of chip capacitor preparation. The optimal cutting technology of thechip capacitor comprises the following steps: enabling the chip capacitor to be covered with a dispersed substance completely, wherein the dispersed substance is cutting force generated when a cutting blade operates at a high speed in the dispersed cutting operation process; and carrying out cutting operation after the dispersed substance is completely cured. During cutting in the cutting technology, force generated when the cutting blade operates at the high speed for cutting is released onto other substances, so that the change of a metal layer is reduced. The phenomena such as burring, crimping and bumping formed by extension, along the direction of cutting force, on a gold electrode during cutting are effectively avoided. The chip capacitor provided by the invention is prepared and obtained after cutting in the optimal cutting technology of the chip capacitor. The gold electrode of the chip capacitor is good in appearance and shape, and is free of the appearance of the phenomena such as burring, crimping and bumping.

Description

technical field [0001] The invention relates to the technical field of chip capacitor preparation, and in particular to an optimized cutting process of a chip capacitor and the chip capacitor. Background technique [0002] During the cutting process of the chip capacitor, the blade will generate a certain motion force during the high-speed rotating cutting. When the blade transmits the force to the carrier to be cut, the carrier will change with the force; and the electrode layer of the chip capacitor is Pure gold electrode layer, gold is a metal with strong ductility and high flexibility. When cutting, the gold electrode will extend in the direction of the cutting force, causing burrs, curling, and bulges. Contents of the invention [0003] The purpose of the present invention is to provide an optimized cutting process for chip capacitors. When cutting, the cutting process releases the force generated by the high-speed cutting of the cutting blade to other substances, the...

AI Technical Summary

Problems solved by technology

[0002] During the cutting process of the chip capacitor, the blade will generate a certain motion force during the high-speed rotating cutting. When the blade transmits the force to the carrier to be cut, the carrier will change with the force; and the electrode layer of the chip capacitor is Pure gold electrode layer, gold is a metal with strong ductility and high flexibility. When cutting, the gold electrode will extend with the direction of the cutting force, causing burrs, curling, and bulges