Circuit board with tin dragging bonding pads
A technology of circuit boards and pads, which is applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of insufficient pulling force, leaving tin tip, unable to prevent tin connection and short circuit, etc., so as to avoid loss, The effect of increasing flexibility
Inactive Publication Date: 2018-02-13
DONGGUAN MOLEX INTERCONNECT
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Problems solved by technology
[0006] However, although the above-mentioned prior art defines that the width of the tin pad 310 is greater than or equal to the pad diameter of the plug-in connector 320, when the tin tip has already touched the adjacent (up, down, left, and right) pins, the above-mentioned patent The dragging tin pad 310 is easy because its area is smaller than the sum of the area of the pads of the two plug-in connectors 320, and there is still insufficient pulling force, and tin tips will still be left, resulting in a short circuit problem
[0007] In addition, since there is only a soldering pad next to the pad of the last soldered plug-in connector in each row, it is necessary to make the circuit board advance in a predetermined single direction during wave soldering, otherwise it will not be able to prevent soldering. The role of preventing short circuit
Method used
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[0038] Preferred embodiments according to the present invention will be described in detail below with reference to the accompanying drawings.
[0039] like figure 2 As shown, the circuit board 10 according to the first embodiment of the present invention includes a first solder pad 111 , a second solder pad 112 , a plurality of plug-in connector pads 120 and a plurality of conductive traces 130 . Wherein, a plurality of conductive traces 130 are respectively connected to each plug-in connector pad 120, and a plurality of plug-in connector pads 120 are arranged in two rows on the circuit board 10, the first solder pad 111, the second solder pad 111, and the second solder pad 111. The pads 112 are all arranged on the side of the two rows of pads 120 away from the forward direction of the circuit board 10 during wave soldering, and the two tin-drawing pads 111 and 112 are both rectangular. The area of the first tin pad 111 and the area of the second tin pad 112 are respect...
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The invention provides a circuit board with tin dragging bonding pads. The circuit board includes a plurality of plug connector bonding pads which are arrayed on the circuit board body in two lines, multiple conductive traces, the first tin dragging bonding pad and the second tin dragging bonding pad, wherein the conductive traces are connected with all the plug connector bonding pads respectively, the first tin dragging bonding pad and the second tin dragging bonding pad are both arranged on one side in the movement direction of the circuit board body when the two lines of the plug connectorbonding pads deviate from wave soldering, and the area of the first tin dragging bonding pad or the area of the second tin dragging bonding pad is greater than or equal to the sum of the areas of thetwo corresponding adjacent plug connector bonding pads. According to the circuit board with the tin dragging bonding pads, the size of each tin dragging bonding pad in the circuit board is large enough, enough tension can be formed during wave soldering, tin tips cannot be left, and therefore short circuit cannot be caused.
Description
technical field [0001] The present invention relates to a circuit board, more particularly, relates to a circuit board with tin-drawing pads. Background technique [0002] With the development of miniaturization and digitalization of electronic products, circuit boards are also developing towards high density and high precision. Therefore, the process design of circuit boards is becoming more and more complicated, and the spacing between component pins is getting smaller and smaller. [0003] Wave soldering is to make the molten solder form a solder wave peak that meets the design requirements, and make the circuit board pre-installed with components pass through the solder wave peak, so as to realize the mechanical and electrical connection between the component solder end or pin and the circuit board pad soft soldering process. The general process of wave soldering is: insert components into the component holes of the corresponding pads - pre-coat flux - preheat - wave so...
Claims
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IPC IPC(8): H05K1/11
CPCH05K1/116H05K2201/0949H05K3/3447H05K2201/09781H05K2203/044H05K3/3468H05K1/111H05K3/3436H05K2201/094
Inventor 熊泽利
Owner DONGGUAN MOLEX INTERCONNECT