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Cold board making method and die

A production method and cold plate technology, which are applied to household appliances, other household appliances, household components, etc., can solve the problems of improper positioning of circuit boards and metal heat sinks, poor products, and misalignment, etc., to improve the product quality rate, Avoid undesirable product effects

Pending Publication Date: 2018-02-23
珠海杰赛科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a cold plate manufacturing method and a mold, which are used to solve the problem in the prior art that the circuit board and the metal cooling block are not properly positioned, which often leads to the deviation of the two and leads to defective products.

Method used

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  • Cold board making method and die

Examples

Experimental program
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Effect test

Embodiment 1

[0039] Such as figure 1 Shown is the flowchart of a kind of manufacturing method of cold plate in the embodiment of the present invention, and this method comprises:

[0040] S101, making a first epoxy resin board thicker than the circuit board, and a second epoxy resin board thicker than the heat dissipation metal board;

[0041] First of all, the circuit board is produced according to the production process, and processed according to the designed size, so as to obtain the circuit board with the specified size.

[0042] The metal cooling plate is processed according to the requirements, and the metal cooling plate of the specified size is obtained.

[0043] Process the first epoxy resin board and the second epoxy resin board according to the size of the circuit board and the metal heat sink. When processing the first epoxy resin board and the second epoxy resin board, in order to place the circuit board on the first In the epoxy resin board, the metal cooling plate is plac...

Embodiment 2

[0060] A kind of cold plate making mold is also provided in the embodiment of the present invention, as Figure 4 Shown is the structural representation of this cold plate making mold, and this mold comprises:

[0061] The first epoxy resin board 401 has a thickness greater than that of the circuit board, and a first fixing module 401a is arranged on the first epoxy resin board 401, wherein the size of the first fixing module 401a is larger than the size of the circuit board;

[0062] The second epoxy resin plate 402 has a thickness greater than that of the heat dissipation metal plate, and a second fixing module 402a is arranged on the second epoxy resin plate 402, wherein the size of the second fixing module 402a is greater than that of the heat dissipation metal plate size;

[0063] Process the first epoxy resin plate 401 and the second epoxy resin plate 402 according to the size of the circuit board and the metal heat sink. When processing the first epoxy resin plate 401 ...

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Abstract

The invention discloses a cold board making method and die. Through the cold board making method, a circuit board and a metal heat dissipation board can be fixed to a epoxy resin board, when laminating is conducted, the circuit board and the metal heat dissipation board can be accurately aligned, the problem of a bad product caused by offset of the circuit board and the metal heat dissipation board due to lack of proper positioning of the circuit board and the metal heat dissipation board is solved, and the product quality rate is improved accordingly.

Description

technical field [0001] The present application relates to the technical field of printed circuit boards, in particular to a method for manufacturing a cold plate and a mold. Background technique [0002] With the development of the electronics industry, there are more and more types of electronic products, and the power density is increasing. How to seek low-cost and fast heat dissipation has become a huge challenge for the design of today's electronics industry. At present, there is still a relatively new method in the circuit board manufacturing industry to solve the problem of heat dissipation and cost—the cold plate, which dissipates the heat generated by integrated circuits and components during operation to the metal block through the main heat dissipation method of heat conduction, and the metal block directly When it comes into contact with the case, the heat is finally conducted to the outside through the case to achieve the cooling effect. [0003] The cold plate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C65/64B29C65/78B29L31/34
CPCB29C65/64B29C65/7855B29C66/45B29C66/72321B29L2031/3425
Inventor 宣光华李超谋赵康段斌
Owner 珠海杰赛科技有限公司
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