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Die ejecting apparatus

A technology for ejecting devices and bare cores, which is applied in transportation and packaging, electrical components, electric solid devices, etc., and can solve problems such as the size and shape of bare cores.

Active Publication Date: 2018-02-23
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a mechanical limit to reducing the pitch of the vias, and therefore it is difficult to aggressively deal with the size and shape of the die

Method used

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Examples

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Embodiment Construction

[0026] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the embodiments described below and may be implemented in various other forms. The following examples are provided not to complete the present invention but to fully convey the scope of the present invention to those skilled in the art.

[0027] In the specification, when an element is referred to as being on or connected to another element or layer, it may be directly on or connected to another element or layer, or may also be There are intermediate elements or layers. In contrast, it will be understood that when an element is referred to as being directly on or connected to another element or layer, it means that there are no intervening elements present. Also, although terms such as first, second, and third are used to describe each region or layer of each embodiment of the present invention, the region or layer is not...

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Abstract

The invention relates to a die ejecting apparatus. The die ejecting apparatus includes a cylindrical cover, a disk-shaped cover rotatably mounted on the upper portion of the cover and having a plurality of through holes, a thimble inserted into the portion of the through holes and configured to separate the die from the cutting tape, and the thimble is moved vertically to separate the bare core drive from the cutting tape. In particular, the through holes are set in a plurality of rows and columns, and the center of the through holes is separated from the center of the cover by a predetermineddistance.

Description

technical background [0001] The present invention relates to a die ejection device. More particularly, the present invention relates to a die ejection apparatus for separating a die from a dicing tape of a framed wafer in a die bonding process, wherein the die is bonded to, for example, a lead frame and on substrates such as printed circuit boards. [0002] Generally, a semiconductor device can be formed by using a silicon wafer as a semiconductor substrate by repeatedly performing a series of preparation processes. A semiconductor device formed as described above may be cut through a dicing process and bonded to a substrate through a die bonding process. [0003] The apparatus for performing a die bonding process may include a pickup module for picking up dies from a framed wafer including dies separated into individual dies by a dicing process, and a bonding module for Bonding the die to a substrate such as a lead frame or printed circuit board. The pick-up module includ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/683
CPCH01L21/67703H01L21/683H01L2221/67H01L2221/683H01L21/67712H01L21/67721H01L21/6836H01L21/68742
Inventor 李喜澈崔一洛李在卿
Owner SEMES CO LTD
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