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Hybrid coloring method for multi-pattern technology

A multi-pattern and color technology, applied in the field of multi-pattern technology, can solve the problems of long color decomposition running time, chip-level color balance and color conflict, etc.

Active Publication Date: 2020-03-24
QUALCOMM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, MPL has many disadvantages, these disadvantages include very long color decomposition run times, color balance problems at the chip level, and color conflicts

Method used

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  • Hybrid coloring method for multi-pattern technology
  • Hybrid coloring method for multi-pattern technology
  • Hybrid coloring method for multi-pattern technology

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Embodiment Construction

[0016] The detailed description, set forth below in connection with the accompanying figures, is intended as a description of various configurations and is not intended to represent the only configurations in which the concepts described herein may be practiced. The detailed description includes specific details to provide a thorough understanding of various concepts. It will be apparent, however, to one skilled in the art that these concepts may be practiced without these specific details. In some instances, well-known structures and components are shown in block diagram form in order to avoid obscuring the concepts. Apparatus and methods will be described in the following detailed description, and may be illustrated in the accompanying drawings by various blocks, modules, components, circuits, steps, procedures, algorithms, elements, and the like. In addition, the term "component" as used herein may be one of parts constituting a system, may be hardware or software or a com...

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Abstract

In one aspect of the present disclosure, a method, computer readable medium and apparatus for assigning characteristic colors for a multi-patterning process are provided. The apparatus receives integrated circuit layout information including a set of features and an assigned color of a plurality of colors for each feature in a first subset of features of the set of features. Additionally, the apparatus performs a color decomposition on the second subset of features to assign colors to features in the second subset of features. The second subset of features includes features in the set of features that are not included in the first subset of features with an assigned color.

Description

[0001] Cross References to Related Applications [0002] This application claims U.S. Provisional Application Serial No. 62 / 182,168, filed June 19, 2015, entitled "HYBRID COLORING METHODOLOGYFOR MULTI-PATTERN TECHNOLOGY," and filed June 14, 2016, entitled "HYBRID COLORING METHODOLOGY FOR MULTI-PATTERN TECHNOLOGY," US Patent Application No. 15 / 182,510, the entire contents of which are expressly incorporated herein by reference. technical field [0003] The present disclosure relates generally to multi-pattern technology, and more particularly to hybrid coloring methods for multi-pattern technology. Background technique [0004] The continual demand for better performance and power consumption of integrated circuits (ICs) has led to enormous technological improvements in the semiconductor industry. Reductions in the size of components within ICs, allowing for greater transistor density, faster speeds and lower power consumption, are one such improvement. [0005] Lithograph...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70433G03F7/70466G03F1/70G06F30/39
Inventor 陈向东H·B·林权武尚M·马拉布里张静维R·G·斯特法尼杨海宁K·雷姆S·S·宋M·古普塔F·旺
Owner QUALCOMM INC