Humidity sensor as well as preparation method of same
A humidity sensor, humidity sensing technology, applied in instruments, scientific instruments, measuring devices, etc., can solve the problems of low linearity of humidity response
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[0044] Such as figure 2 As shown, the preparation method of the humidity sensor in one embodiment is a preparation method of the above-mentioned humidity sensor, and the preparation method of the humidity sensor includes the following steps:
[0045] Step S210: forming electrodes on the substrate.
[0046] Wherein, the material of the substrate is an insulating material such as glass, ceramics, and organic polymer film. Alternatively, the substrate can also be a silicon wafer with a silicon dioxide layer formed on the surface; the thickness of the silicon dioxide layer is 2 microns to 20 microns.
[0047] Specifically, the electrodes are interdigital electrodes.
[0048] Further, the width of each finger of the electrode is 2 micrometers to 2 millimeters; the distance between two adjacent fingers is 2 micrometers to 2 millimeters.
[0049] Specifically, the electrode includes a conductive layer, and the material of the conductive layer is selected from one of gold, aluminu...
Embodiment 1
[0068] The preparation process of the humidity sensor of this embodiment is as follows:
[0069] (1) On the silicon wafer with a silicon dioxide layer with a thickness of 20 microns, the electrode pattern is formed by photolithography, and then the interdigitated electrode is formed by electron beam evaporation. The width of each interdigitated electrode of the interdigitated electrode is is 20 microns, the distance between two adjacent interdigital fingers is 20 microns, and the area of the interdigital electrodes is 3mm×5mm. Wherein, the interdigital electrode is composed of a stacked chromium layer with a thickness of 5 nanometers and a gold layer with a thickness of 50 nanometers, and the side of the chromium layer away from the gold layer is stacked with the silicon dioxide layer of the silicon wafer.
[0070] (2) Mix the first moisture-sensitive material with water evenly, and adjust the pH value to 10 with ammonia water to obtain a pre-prepared liquid; mix the second ...
Embodiment 2
[0073] The preparation process of the humidity sensor of this embodiment is as follows:
[0074] (1) On the silicon wafer with a silicon dioxide layer with a thickness of 2 microns, the electrode pattern is formed by photolithography, and then the interdigitated electrode is formed by electron beam evaporation. The width of each interdigitated electrode of the interdigitated electrode is The distance between two adjacent fingers is 2 microns, and the area of the interdigital electrodes is 3mm×5mm. Wherein, the interdigital electrode is composed of a stacked chromium layer with a thickness of 6 nanometers and a gold layer with a thickness of 100 nanometers, and the side of the chromium layer away from the gold layer is stacked with the silicon dioxide layer of the silicon wafer.
[0075] (2) Mix the first moisture-sensitive material with water evenly, and adjust the pH value to 10 with ammonia water to obtain a pre-prepared liquid; mix the second moisture-sensitive material w...
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