Automatic thermal protruding device for printed circuit board

Abstract

The invention provides an automatic thermal protruding device for a printed circuit board. The device comprises a device framework, and a group including a punch press platform, a carrying system platform and a loading and unloading platform and arranged on the device framework. The punch press platform is provided with a punch press. The punch press is provided with an upper mold loading plate. Alead screw is arranged on the carrying system platform and is provided with a carrying mechanism. The carrying mechanism includes a carrying Z-axis slide rail equipped with a mechanical arm corresponding to the upper mold loading plate. The loading and unloading platform is provided with a lead screw rack. The lead screw rack is provided with a loading and unloading mechanism and a mold opening and closing cover mechanism. The loading and unloading platform is also provided with a material tray corresponding to the loading and unloading mechanism. The automatic thermal protruding device improves the production efficiency of the product, reduces labor cost, eliminates the influence of the operators on the product quality, and enables the product to smoothly pass the reliability test of high temperature and high humidity.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and in particular relates to an automatic heat embossing device for a printed circuit board. Background technique [0002] The current embossing process of printed circuit boards is completed by simple manual operations, and is formed by regular heating and natural cooling. [0003] There are following disadvantages: [0004] (1) Reliability test: The raised surface will collapse in the environmental test with a temperature of 70 degrees Celsius and a humidity of 50%, which will cause open circuit and short circuit in the actual use process, affecting the performance of the product; [0005] (2) The highly unstable products of pure manual work have a high scrap rate, high testing cost, and the quality is greatly affected by human factors; [0006] (3) The production efficiency of pure manual operation is low and the degree of automation is low; [0007] (4) Working in a high-t...

AI Technical Summary

Problems solved by technology

[0004] (1) Reliability test: The raised surface will collapse in the environmental test with a temperature of 70 degrees Celsius and a humidity of 50%, which will cause open circuit and short circuit in the actual use process, which will affect the performance of the product;

[0005] (2) The highly unstable and scrapped rate of purely manual products is high, the inspection cost is high, and the quality is greatly affected by human factors;

[0006] (3) The production efficiency of pure manual operation is low and the degree of automation is low;

[0007] (4) Working in a high temperature environment may easily cause burns

Images