Automatic thermal protruding device for printed circuit board

Abstract

The invention provides an automatic thermal embossing equipment for printed circuit boards, which includes an equipment frame, a punching platform, a handling system platform, and a loading and unloading platform arranged on the equipment frame, the punching platform is provided with a punching machine, and the punching machine An upper mold loading plate is provided, a screw rod is provided on the conveying system platform, and a conveying mechanism is provided on the threaded rod, and the conveying mechanism includes a conveying Z-axis slide rail, and a manipulator is arranged on the conveying Z-axis slide rail , the manipulator corresponds to the loading plate of the upper mold, the screw rack is provided on the loading and unloading platform, the loading and unloading mechanism and the mold opening and closing mechanism are arranged on the screw rack, and the loading and unloading platform is also provided with There is a tray, and the tray corresponds to the loading and unloading mechanism. The invention improves product production efficiency, reduces labor costs and eliminates the influence of operators on product quality, and enables the product to pass the reliability test of high temperature and high humidity smoothly.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and in particular relates to an automatic heat embossing device for a printed circuit board. Background technique [0002] The current embossing process of printed circuit boards is completed by simple manual operations, and is formed by regular heating and natural cooling. [0003] There are following disadvantages: [0004] (1) Reliability test: The raised surface will collapse in the environmental test with a temperature of 70 degrees Celsius and a humidity of 50%, which will cause open circuit and short circuit in the actual use process, affecting the performance of the product; [0005] (2) The highly unstable products of pure manual work have a high scrap rate, high testing cost, and the quality is greatly affected by human factors; [0006] (3) The production efficiency of pure manual operation is low and the degree of automation is low; [0007] (4) Working in a high-t...

AI Technical Summary

Problems solved by technology

[0004] (1) Reliability test: The raised surface will collapse in the environmental test with a temperature of 70 degrees Celsius and a humidity of 50%, which will cause open circuit and short circuit in the actual use process, affecting the performance of the product;

[0005] (2) The highly unstable pro

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