Stage leveling device improving leveling maintenance and used for high performance mask aligner

Abstract

Disclosed is a stage leveling device for a high-performance mask aligner, having enhanced leveling maintenance and, in particular, a novel technology of preventing leveling misalignment by firmly fixing a leveling-completed wafer stage. A conventional leveling device fixes a leveling-completed wafer stage by partially pressing side surfaces of a leveling rod and thus the leveling is misaligned dueto deviations (errors) occurring while the leveling rod is moved upward and downward and leftward and rightward, and slip occurs due to a weak fixing strength of the leveling rod and thus the weightof the wafer (sample) that can be leveled to the maximum extent is decreased. To address the problems described above, according to the present invention, when a locking ring (80) inserted at an outerside of a leveling rod (40;41) maintains an inclined state, locking is performed such that an inner circumferential surface of the locking ring fixes opposite sides of the leveling rod by applying pressure thereto and, when the locking ring maintains a horizontal state, unlocking is performed such that the inner circumferential surface of the locking ring is spaced apart from the leveling rod.

Description

technical field [0001] The present invention relates to a new concept technology of stabilizing the leveled wafer workbench and preventing leveling distortion, increasing the maximum capacity (weight) of the leveled wafer to improve its performance. Background technique [0002] In recent years, semiconductor devices must be highly integrated in order to achieve the low cost and high quality required to ensure competitiveness. In order to achieve high integration, it will be accompanied by the process of scaling down the gate oxide film thickness and channel length of transistor elements, etc., thus, the technology and preparation system of semiconductor manufacturing process are also in a diversified development form . [0003] The photo-lithography process, which is one of the semiconductor manufacturing processes, consists of the following processes, namely, a wafer cleaning process to remove foreign matter on the wafer surface; treating the surface of the wafer so that ...

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Problems solved by technology

[0010] Moreover, the air pusher in the above-mentioned prior art adopts a general cylinder, and its initial setting value is large, so not only the flexibility of operation is deteriorated, but also the problem of difficult adjustment of the small pressure will be caused.

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