Contact thermal resistance measuring device with adjustable loading pressures in vacuum vessel

A vacuum container and contact thermal resistance technology, applied in the direction of material thermal development, can solve problems such as difficulty in changing contact pressure, and achieve the effect of improving accuracy and simplifying the test process and time.

Inactive Publication Date: 2018-03-09
THE GENERAL DESIGNING INST OF HUBEI SPACE TECH ACAD
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Problems solved by technology

Generally, the physical properties of materials and surface optical characteristic parameters can generally be obtained by consulting the data, while the contact thermal resistance is usually only obtained through experimental measurements due to the influence of various factors such as the state of the contact surface, contact pressure, temperature, and connection method.
[0003] During the contact thermal resistance measurement test, the main body of the measuring device is often located in a vacuum container, which makes it difficult for the test implementer to change the contact pressure at any time during the test

Method used

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  • Contact thermal resistance measuring device with adjustable loading pressures in vacuum vessel

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Embodiment Construction

[0014] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described below in conjunction with the accompanying drawings and examples. It should be understood that the specific examples described here are only used to explain the present invention, not to limit the present invention.

[0015] A contact thermal resistance measurement device with adjustable loading pressure in a vacuum container, comprising: a vacuum container, a test system, and a data acquisition system, wherein:

[0016] The test system includes: test platform, heating unit, cooling unit, and pressurization unit; the test platform is composed of a platform, test bracket, and fixing device; the heating unit is composed of a heater, insulation layer, and thermocouple; the cooling unit is composed of a cooling device, a cooling source , circulation pump, cooling night, the pressurization unit is composed of pressure sensor, lea...

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Abstract

The invention discloses a contact thermal resistance measuring device with adjustable loading pressures in a vacuum vessel. The contact thermal resistance measuring device comprises the vacuum vessel,a test system and a data acquisition system. The test system comprises a test platform, a heating unit, a cooling unit and a pressurizing unit; the pressurizing unit comprises a pressure sensor, a lead screw pressurizing device and a driving motor. The contact thermal resistance measuring device has the advantages that screws can be driven by the motor to rotate, contact pressures of test piecescan be changed, manual screw rotation can be replaced, accordingly, a series of operation of vacuum vessel re-pressing, manual screw rotation, vacuumizing and the like required in each test can be omitted, test processes can be simplified to a great extent, and the test time can be shortened to a great extent; feedback compensation further can be carried out on pressure deviation due to temperature change, and accordingly the test precision can be improved.

Description

technical field [0001] The invention relates to the thermal control design of a spacecraft, in particular to a contact thermal resistance measuring device capable of adjusting loading pressure in a vacuum vessel. Background technique [0002] The spacecraft thermal control is a system that controls the heat exchange process between the interior of the spacecraft and the space environment, so that the spacecraft is always within a suitable temperature range. The performance and reliability of this system directly affect the working status and life of the entire spacecraft, so it can be said to be an indispensable technical support system for spacecraft. The thermal control design of spacecraft relies on thermal analysis calculations and ground thermal simulation experiments. In addition to a series of thermal performance parameters of materials and surfaces, thermal analysis calculations also involve some non-thermal physical parameters, such as the relationship between solid...

Claims

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Application Information

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IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 徐航段枭项斌刘萧磊孙述鹏池贤彬余先伟
Owner THE GENERAL DESIGNING INST OF HUBEI SPACE TECH ACAD
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