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Method for manufacturing different directions of surface metal circuits on small insulator

A technology for metal circuits and manufacturing methods, which is applied in the direction of removing conductive materials by chemical/electrolytic methods to achieve the effects of increasing usable area, reducing time, and improving finish

Inactive Publication Date: 2018-03-20
SHANGHAI AMPHENOL AIRWAVE COMM ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the above-mentioned problems encountered in the manufacture of metal circuits on the surface of different orientations of small-sized insulators, and proposes a method for manufacturing metal circuits on surfaces of different orientations on small insulators

Method used

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  • Method for manufacturing different directions of surface metal circuits on small insulator
  • Method for manufacturing different directions of surface metal circuits on small insulator
  • Method for manufacturing different directions of surface metal circuits on small insulator

Examples

Experimental program
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Effect test

Embodiment 1

[0052] see figure 1 , the metal circuit manufacturing method on the surface of different orientations on the small insulator of the present invention comprises:

[0053] Step 1: Make a plastic bracket, and at least one insulator is arranged on the bracket;

[0054] The bracket can be a plastic bracket or a metal bracket. If a plastic bracket is selected, the bracket can be made by injection molding. In this embodiment 1, a plastic insulator is used as an example. Of course, brackets of other materials can also be used. Be specific. The color of the bracket is preferably white. When making, first make the bracket connecting the insulator according to the size of the insulator, at least one insulator is arranged in the bracket, the periphery of the insulator is provided with a frame, and the insulator is arranged on the bracket through the frame, therefore, the number of insulators on the bracket can be configured as required, See figure 2 , in order to facilitate the produ...

Embodiment 2

[0068] This embodiment provides a method for manufacturing metal circuits on different orientation surfaces on a small insulator. Different from the plastic insulator in Embodiment 1, the bracket in this embodiment is made of metal. For the specific manufacturing method, see Figure 6 , now cooperate Figure 6 The manufacturing method is explained:

[0069] Step 1: making a metal bracket, at least one insulator is arranged on the bracket;

[0070] When making, first make the metal bracket connecting the insulator according to the size of the insulator. The metal bracket is formed by die-casting or forging or CNC, and then electrostatically sprays plastic on the surface to form a metal bracket. The color of the bracket is preferably white. At least one insulator is arranged in the bracket, and the periphery of the insulator is provided with a frame. The insulator is arranged on the bracket through the frame. Therefore, the number of insulators on the bracket can be configured...

Embodiment 3

[0079] On the basis of Embodiment 1, the present invention also provides a metal circuit manufacturing method on a small insulator with different orientation surfaces, see Figure 7 , now take the plastic insulator as an example to illustrate:

[0080] Step 1: making a bracket, at least one insulator is arranged on the bracket;

[0081] The bracket can be a plastic bracket or a metal bracket. For example, it can be made of a plastic bracket by injection molding, or a metal bracket connected to the insulator can be made according to the size of the insulator. The metal bracket can be molded by die-casting or forging or CNC, and then the plastic is electrostatically sprayed on the surface , thus forming a metal stent. Of course, brackets made of other materials may also be used, which is not specifically limited here. When making the bracket, first make the bracket connecting the insulator according to the size of the insulator. At least one insulator is arranged in the bracke...

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Abstract

The invention relates to the technical field of a printed circuit board manufacturing method, and specifically relates to a method for manufacturing different directions of surface metal circuits on asmall insulator. The method comprises the steps of manufacturing a bracket, wherein the bracket is provided with at least one insulator; plating metal on the bracket to serve as a seed layer; ablating the seed layer along the outer contour of a circuit by laser, and dividing the seed layer into a circuit area and a non-circuit area which are electrically insulated from each other; thickening thecircuit area and the non-circuit area; removing the metal in the non-circuit area and processing the surface of the circuit area so as to obtain an insulator with different directions of surface metalcircuits. According to the invention, the circuit area and the non-circuit area are thickened, and then the metal and the residual metal in the non-circuit area are removed by adopting a combinationof electrolytic deplating and soft-chemistry deplating, so that more precise metal circuits can be formed on the insulator, the bracket of the insulator is connected by using the frame, and productionoperation, follow-up plating and metal deplating are facilitated.

Description

technical field [0001] The invention relates to the technical field of manufacturing methods of printed circuit boards, in particular to a method for manufacturing metal circuits on different orientation surfaces on a small insulator. Background technique [0002] The development of electronic products tends to be miniaturized gradually, which leads to the circuit layout applied on it is different from that of existing circuit boards that are superimposed and distributed on mutually parallel planes. For example, the fine metal lines of sensor circuits are distributed in different directions of small insulators. . Therefore, the traditional PCB manufacturing process for metal lines is difficult to meet the layout requirements of small insulator applications, thus forming some special manufacturing technologies for metal lines, but the existing metal line manufacturing technology is limited by its manufacturing process, such as insulators The surface formed by laser ablation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
Inventor 满方明
Owner SHANGHAI AMPHENOL AIRWAVE COMM ELECTRONICS CO LTD
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