Method for manufacturing different directions of surface metal circuits on small insulator

A technology for metal circuits and manufacturing methods, which is applied in the direction of removing conductive materials by chemical/electrolytic methods to achieve the effects of increasing usable area, reducing time, and improving finish
CN107820366AInactive Publication Date: 2018-03-20SHANGHAI AMPHENOL AIRWAVE COMM ELECTRONICS CO LTD
4 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI AMPHENOL AIRWAVE COMM ELECTRONICS CO LTD
Publication Date
2018-03-20
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention relates to the technical field of a printed circuit board manufacturing method, and specifically relates to a method for manufacturing different directions of surface metal circuits on asmall insulator. The method comprises the steps of manufacturing a bracket, wherein the bracket is provided with at least one insulator; plating metal on the bracket to serve as a seed layer; ablating the seed layer along the outer contour of a circuit by laser, and dividing the seed layer into a circuit area and a non-circuit area which are electrically insulated from each other; thickening thecircuit area and the non-circuit area; removing the metal in the non-circuit area and processing the surface of the circuit area so as to obtain an insulator with different directions of surface metalcircuits. According to the invention, the circuit area and the non-circuit area are thickened, and then the metal and the residual metal in the non-circuit area are removed by adopting a combinationof electrolytic deplating and soft-chemistry deplating, so that more precise metal circuits can be formed on the insulator, the bracket of the insulator is connected by using the frame, and productionoperation, follow-up plating and metal deplating are facilitated.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the technical field of manufacturing methods of printed circuit boards, in particular to a method for manufacturing metal circuits on different orientation surfaces on a small insulator. Background technique

[0002] The development of electronic products tends to be miniaturized gradually, which leads to the circuit layout applied on it is different from that of existing circuit boards that are superimposed and distributed on mutually parallel planes. For example, the fine metal lines of sensor circuits are distributed in different directions of small insulators. . Therefore, the traditional PCB manufacturing process for metal lines is difficult to meet the layout requirements of small insulator applications, thus forming some special manufacturing technologies for metal lines, but the existing metal line manufacturing technology is limited by its manufacturing process, such as insulators The surface formed by laser ablation ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More