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Sectioning device for silicon crystal rod for electronic element

A technology for electronic components and silicon crystal rods, which is applied in the field of silicon crystal rod cutting devices for electronic components, can solve the problems of inconvenient collection and low cutting efficiency, and achieve the effect of enhancing reliability and safety and avoiding damage

Inactive Publication Date: 2018-03-23
钟苡苇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the shortcomings of low cutting efficiency and inconvenient collection in the silicon crystal rod cutting device, the technical problem to be solved by the present invention is to provide a silicon crystal rod cutting device for electronic components

Method used

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  • Sectioning device for silicon crystal rod for electronic element
  • Sectioning device for silicon crystal rod for electronic element
  • Sectioning device for silicon crystal rod for electronic element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A silicon crystal bar cutting device for electronic components, such as Figure 1-7 As shown, it includes a frame 1, a lifting mechanism 2, a mounting plate 3, a cutting knife 4, a bracket 5, a blanking mechanism 6 and a collection frame 7. The top of the frame 1 is provided with a lifting mechanism 2, and the bottom of the lifting mechanism 2 is provided with a mounting plate. Plate 3, a cutting knife 4 is installed on the bottom of the mounting plate 3, a support 5 is installed symmetrically in the middle of the left and right side walls in the frame 1, and a blanking mechanism 6 is provided on the support 5, and the blanking mechanism 6 is located on the front of the cutting knife 4. Below, a collection frame 7 is placed in the middle of the inner bottom of the frame 1 .

Embodiment 2

[0038] A silicon crystal bar cutting device for electronic components, such as Figure 1-7 As shown, it includes a frame 1, a lifting mechanism 2, a mounting plate 3, a cutting knife 4, a bracket 5, a blanking mechanism 6 and a collection frame 7. The top of the frame 1 is provided with a lifting mechanism 2, and the bottom of the lifting mechanism 2 is provided with a mounting plate. Plate 3, a cutting knife 4 is installed on the bottom of the mounting plate 3, a support 5 is installed symmetrically in the middle of the left and right side walls in the frame 1, and a blanking mechanism 6 is provided on the support 5, and the blanking mechanism 6 is located on the front of the cutting knife 4. Below, a collection frame 7 is placed in the middle of the inner bottom of the frame 1 .

[0039] The lifting mechanism 2 includes a rack 201, a motor 202, a sector gear 203, a pole 204, a vertical slider 205, a vertical slide rail 206 and a spring 207, and the top of the frame 1 is prov...

Embodiment 3

[0041] A silicon crystal bar cutting device for electronic components, such as Figure 1-7 As shown, it includes a frame 1, a lifting mechanism 2, a mounting plate 3, a cutting knife 4, a bracket 5, a blanking mechanism 6 and a collection frame 7. The top of the frame 1 is provided with a lifting mechanism 2, and the bottom of the lifting mechanism 2 is provided with a mounting plate. Plate 3, a cutting knife 4 is installed on the bottom of the mounting plate 3, a support 5 is installed symmetrically in the middle of the left and right side walls in the frame 1, and a blanking mechanism 6 is provided on the support 5, and the blanking mechanism 6 is located on the front of the cutting knife 4. Below, a collection frame 7 is placed in the middle of the inner bottom of the frame 1 .

[0042] The lifting mechanism 2 includes a rack 201, a motor 202, a sector gear 203, a pole 204, a vertical slider 205, a vertical slide rail 206 and a spring 207, and the top of the frame 1 is prov...

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Abstract

The invention relates to a cutting device, in particular to a silicon crystal bar cutting device for electronic components. The technical problem to be solved by the present invention is to provide a silicon crystal bar cutting device for electronic components. In order to solve the above-mentioned technical problems, the present invention provides such a device for cutting silicon crystal rods for electronic components, including a frame, etc.; the top of the frame is provided with a lifting mechanism, and the bottom of the lifting mechanism is provided with a mounting plate, and the bottom of the mounting plate is installed There is a cutting knife, and brackets are symmetrically installed in the middle of the left and right sides of the frame, and a blanking mechanism is arranged on the bracket, and the blanking mechanism is arranged directly below the cutting knife, and a collection frame is placed in the middle of the bottom of the frame. The invention achieves the effect of high cutting efficiency and convenient collection, the cutting knife can quickly cut off the silicon crystal rod, the operation is simple, and the poor parts at both ends of the silicon crystal rod can fall into the recovery frame.

Description

technical field [0001] The invention relates to a cutting device, in particular to a silicon crystal bar cutting device for electronic components. Background technique [0002] Electronic components are the basis of electronic products. Commonly used electronic components include: resistors, capacitors, inductors, potentiometers, transformers, etc. In terms of installation methods, they can be divided into two categories: traditional installation and surface installation. Transistors and diodes are called electronic devices. [0003] Silicon ingots are an important part of the preparation of electronic components. During their production and preparation, they need to be cut into sections to remove the parts with poor quality at both ends for subsequent processing. At present, the silicon ingot sectioning device has a section Due to the disadvantages of low efficiency and inconvenient collection, it is urgent to develop a silicon ingot cutting device for electronic componen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D5/00
CPCB28D5/04B28D5/0058B28D5/0082
Inventor 钟苡苇
Owner 钟苡苇
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