Molding powder bonding device

Abstract

A plastic powder bonding device, including a reaction tank, a base and a driving device, and a stirring mechanism in the tank. The tank body is a cylindrical container with an upper opening. The inner cylinder of the tank is provided with multi-layer annular cooling fins, and the tank cover is provided with An oxygen detector is installed on the inside of the feeding port and the tank cover. The stirring mechanism is composed of a rotating shaft and a first vane group, a second vane group, a third vane group, and a fourth vane group that are socketed on the rotating shaft from top to bottom. A water-cooling circuit is provided in the stirring blade, a nitrogen passage is provided in the reaction tank, and the driving device is that the motor drives the rotating shaft to rotate through a belt transmission mechanism. In plastic powder bonding, this device can not only ensure the temperature rise requirement, so that the plastic powder and pigment can be quickly bonded, but also can take away excess heat to prevent material agglomeration, and the nitrogen circuit can ensure safe production.

Description

technical field [0001] The invention relates to a plastic powder manufacturing device, in particular to a plastic powder bonding device. Background technique [0002] Plastic powder is the material of the plastic spraying process. Simply put, the plastic powder is sprayed onto the surface of the material by the wind (by electrostatic spray) after being heated at a high temperature. The effect of plastic spraying is good, the cost is low, the color is positive, and it is beautiful. Plastic powder is a thermosetting powder for electrostatic spraying, which contains solid resin for coating, pigments, fillers, additives and other ingredients. Plastic powder binding is to heat the resin powder base to a temperature slightly lower than the softening point of the resin. At this time, the working state should be that the surface of the resin powder base melts, while the inside of the resin powder base is still in a solid state. At this time, let the pigment powder particles It is ...

AI Technical Summary

Problems solved by technology

If the binding temperature is higher than the critical temperature, the surface layer of the resin powder base will not melt enough, resulting in the pigment powder not being able to bind to the resin powder base is not strong enough; if the binding temperature is higher than the critical temperature, it will cause the entire resin powder base to melt and bond In a group, the binding cannot be achieved

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