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Supersonic vibration-assisted metal coin stamp embossing formation device and method

An auxiliary metal and ultrasonic vibration technology, which is applied in the direction of vibrating fluid, printing, stamping, etc., can solve the problems of reducing the life of the die, the bright band of the flash line of the coin and stamp, and the cracking of the die, so as to achieve the suppression of the formation of surface defects, Effect of improving surface finish and increasing service life

Pending Publication Date: 2018-03-30
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the imprinting force is too large, not only the blank cake material will flow along the gap between the upper and lower dies and the middle ring, resulting in burrs, resulting in scrapped products, but also induced die cracking, seriously reducing the life of the die
For coins with high relief of some patterns, even if the imprinting force is increased to the limit value allowed by the die, the flat cake material cannot completely fill the cavity
At the same time, under the action of a large embossing force, there will be quality defects such as flashing lines and bright bands on the surface of coins and stamps.

Method used

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  • Supersonic vibration-assisted metal coin stamp embossing formation device and method
  • Supersonic vibration-assisted metal coin stamp embossing formation device and method
  • Supersonic vibration-assisted metal coin stamp embossing formation device and method

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Embodiment Construction

[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0029] refer to Figure 1 to Figure 5 , according to one aspect of the present invention, provides a kind of ultrasonic vibration assisted metal coin seal embossing forming device, comprises lower die, upper die, guiding mechanism, ultrasonic horn 6, ultrasonic transducer 5 and ultrasonic generator 17, in,

[0030] The lower mold includes a lower mold base 8, a lower template 9, a backing plat...

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Abstract

The invention belongs to the technical field of coin stamp manufacturing, and discloses a coin stamp embossing formation device and method. The device comprises a lower die, an upper die, a guide mechanism, an ultrasonic amplitude transformer, an ultrasonic transducer and an ultrasonic generator. The lower die comprises a lower die holder, a lower die plate, a backing plate, a lower coining die, amiddle ring and an ejector rod. The upper die comprises an upper die holder, a connecting sleeve, an upper die fixing plate and an upper coining die. The method includes the following steps that (1)a metal billet cake is put onto the lower coining die; (2) the ultrasonic transducer and the ultrasonic generator are connected through an electric wire, the vibrational frequency is set and the ultrasonic generator is started; (3) the upper coining die is driven by a coining forming machine to move downwards, and the billet cake is deformed; and (4) after the upper coining die moves downwards toa set position, coin stamp forming is completed; and then the upper coining die is driven by the coining forming machine to move upwards, and the ejector rod moves upwards to push out a coin stamp. The coin stamp fully filled can be obtained under the action of low embossing force, and meanwhile the service life of the coining dies is prolonged.

Description

technical field [0001] The invention belongs to the technical field of coin stamp manufacturing, and more particularly relates to a coin stamp embossing forming device and method. Background technique [0002] Coins and medals are generally produced by the closed stamping process. The deformation of the material mainly occurs on the surface of the cake during imprinting. When the die is closed, the material is difficult to flow radially, which is similar to extrusion deformation in a local area, and the deformation resistance is very large. In order to realize the smooth filling of the pattern on the surface of coins and avoid the defects of insufficient filling, it is necessary to apply a sufficient embossing force. In order to improve the anti-counterfeiting performance of coins and stamps and meet people's aesthetic needs for coins and stamps, the design of coin stamp surface patterns is becoming more and more complex, and the embossing force required to complete the fil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41K3/04B06B1/10
CPCB06B1/10B41K3/04
Inventor 柳玉起李巧敏章志兵
Owner HUAZHONG UNIV OF SCI & TECH
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