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Wafer processing equipment and method

A technology of wafer processing and equipment, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as the influence of the lower surface of the wafer

Inactive Publication Date: 2018-04-13
HUAIAN IMAGING DEVICE MFGR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In the existing wafer processing equipment, when the wafer is placed on the base for processing, since there is a gap between the upper surface of the base and the lower surface of the wafer (especially when the upper surface of the base and / or the lower surface of the wafer When the surface is uneven), the processing gas used for the upper surface of the wafer in the processing equipment will diffuse / flow into the gap between the upper surface of the susceptor and the lower surface of the wafer, thereby affecting the lower surface of the wafer

Method used

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  • Wafer processing equipment and method
  • Wafer processing equipment and method
  • Wafer processing equipment and method

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Embodiment Construction

[0025] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure unless specifically stated otherwise.

[0026] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way intended as any limitation of the disclosure, its application or uses.

[0027] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the Authorized Specification.

[0028] In all examples shown and discussed herein, any specific values ​​should be construed as illustrative only, and not as limiting. Therefore, other examples of the exemplary ...

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Abstract

The invention relates to wafer processing equipment and method. The equipment comprises a processing cavity and a base, wherein the base is placed in the processing cavity, a region is arranged on anupper surface of the base and is used for placing a wafer, the base comprises one or more first air inlets and one or more first air outlets, the first air inlets are arranged at a central part of theregion and are used for allowing a protection gas to flow onto an upper surface of the base via the first air inlets, the first air outlets are arranged at an edge part of the region and are used forallowing the protection gas on the upper surface of the base to flow into the base via the first air outlets, and the protection gas is used for protecting a lower surface of the wafer so that the lower surface of the wafer is free from influence of a processing gas of an upper surface of the wafer. By the equipment, the influence of the processing gas on the lower surface of the wafer can be prevented.

Description

technical field [0001] The present disclosure relates to semiconductor technology, and in particular, to a wafer processing device and method. Background technique [0002] In the existing wafer processing equipment, when the wafer is placed on the base for processing, since there is a gap between the upper surface of the base and the lower surface of the wafer (especially when the upper surface of the base and / or the lower surface of the wafer When the surface is not flat), the processing gas for the upper surface of the wafer in the processing equipment diffuses / flows into the gap between the upper surface of the susceptor and the lower surface of the wafer, thereby affecting the lower surface of the wafer. This is not desired. [0003] Therefore, it is necessary to propose a new technology to solve the above-mentioned problems in the prior art. Contents of the invention [0004] It is an object of the present disclosure to avoid the effect of process gases on the lowe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/67H01L21/673
CPCH01L21/02H01L21/67017H01L21/673
Inventor 李国强林宗贤吴龙江
Owner HUAIAN IMAGING DEVICE MFGR CORP