A preparation technology of high temperature resistant flexible copper clad laminate base material
A technology of flexible copper-clad laminates and nitrile polymers, which is applied to flat products, other household appliances, household appliances, etc., can solve the problems of high price, high dielectric constant, and difficult processing, etc. cost saving effect
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Embodiment 1
[0019] Step (1) uniformly dissolve 10g of polyarylether nitrile and 0.5g of curing agent in 50ml of N-methylpyrrolidone;
[0020] Step (2) pouring the homogeneously dissolved polyarylether nitrile solution on a glass plate, and placing it in a drying oven to remove the solvent;
[0021] Step (3) Lay up the polyarylether nitrile film obtained in step (2) neatly, attach copper foil up and down, place it in a steel plate mold, set the temperature of the hot stage to 280°C, apply pressure slowly to remove air bubbles, and maintain the pressure at 2MP. Maintain temperature and pressure for 2 hours;
[0022] Step (4) After step (3) is solidified and naturally cooled to room temperature, the mold is removed to obtain the flexible copper clad laminate material.
[0023] The surface of the flexible copper clad laminate material obtained after curing by step (4) is smooth, without defects such as bubbles; test its thermal decomposition temperature (T 5％ ) is 480°C, the glass transitio...
Embodiment 2
[0025] Step (1) uniformly dissolve 10g of polyarylether nitrile and 0.6g of curing agent in 50ml of N-methylpyrrolidone;
[0026] Step (2) pouring the homogeneously dissolved polyarylether nitrile solution on a glass plate, and placing it in a drying oven to remove the solvent;
[0027] Step (3) Lay the polyarylether nitrile film obtained in step (2) neatly, attach copper foil up and down, place it in a steel plate mold, set the temperature of the hot stage to 260°C, apply pressure slowly to remove air bubbles, and maintain the pressure at 2MP. Maintain temperature and pressure for 2 hours;
[0028] Step (4) After step (3) is solidified and naturally cooled to room temperature, the mold is removed to obtain the flexible copper clad laminate material.
[0029] The surface of the flexible copper clad laminate material obtained after curing by step (4) is smooth, without defects such as bubbles; test its thermal decomposition temperature (T 5％ ) is 485°C, the glass transition t...
Embodiment 3
[0031] Step (1) uniformly dissolve 10g of polyarylether nitrile and 0.7g of curing agent in 50ml of N-methylpyrrolidone;
[0032] Step (2) pouring the homogeneously dissolved polyarylether nitrile solution on a glass plate, and placing it in a drying oven to remove the solvent;
[0033] Step (3) Lay the polyarylether nitrile film obtained in step (2) neatly, attach copper foil up and down, place it in a steel plate mold, set the temperature of the hot stage to 260°C, apply pressure slowly to remove air bubbles, and maintain the pressure at 2MP. Maintain temperature and pressure for 2 hours;
[0034] Step (4) After step (3) is solidified and naturally cooled to room temperature, the mold is removed to obtain the flexible copper clad laminate material.
[0035] The surface of the flexible copper clad laminate material obtained after curing by step (4) is smooth, without defects such as bubbles; test its thermal decomposition temperature (T 5％ ) is 484°C, the glass transition t...
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