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Preparation technology of a high temperature-resistant resin-based copper clad laminate

A copper-clad laminate and nitrile-based resin technology, applied in coatings and other directions, can solve problems such as poor heat resistance and high dielectric constant, achieve long service life, improve mechanical strength and modulus, and improve batch development benefits.

Active Publication Date: 2019-11-29
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a preparation technology for materials for high temperature-resistant copper clad laminates in view of the shortcomings of traditional epoxy resins such as high dielectric constant and poor heat resistance, which realizes the medium and low temperature processing of the resin matrix and simplifies the processing technology; At the same time, the performance of this material has been significantly improved on the basis of traditional materials. It has high temperature resistance and low dielectric constant, and at the same time improves the mechanical strength and modulus of the copper clad laminate to ensure its dimensional stability under load. performance to meet today's harsh application environments

Method used

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  • Preparation technology of a high temperature-resistant resin-based copper clad laminate
  • Preparation technology of a high temperature-resistant resin-based copper clad laminate
  • Preparation technology of a high temperature-resistant resin-based copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Step (1) Dissolve 2g of polyarylether nitrile in 10ml of N-methylpyrrolidone, apply it evenly on the surface of glass fiber cloth, and obtain reinforcing fiber after drying;

[0024] Step (2) Mix 50g of nitrile resin prepolymer with 2.5g of curing agent and dissolve in N,N-dimethylformamide, heat the mixed solution to 100°C, stir evenly and then impregnate in step (1) to obtain reinforced fiber;

[0025] Step (3) placing the impregnated reinforcing fiber obtained in step (2) in a drying oven, drying at 140° C. for 4 hours, removing the solvent, and obtaining a prepreg;

[0026] Step (4) Lay up the prepregs obtained in step (3) neatly, place them in a steel plate mold and place them on a hot-pressing platform, set the temperature of the hot-pressing platform to 200°C, apply pressure slowly to remove air bubbles, and maintain the pressure 15MP, maintain temperature and pressure for 2 hours;

[0027] Step (5) After step (4) is solidified and naturally cooled to room temp...

Embodiment 2

[0030] Step (1) Dissolve 2.5g of polyarylether nitrile in 10ml of N-methylpyrrolidone, apply it evenly on the surface of glass fiber cloth, and obtain reinforcing fiber after drying;

[0031] Step (2) Mix 50g of nitrile resin prepolymer with 3.0g of curing agent and dissolve in N,N-dimethylformamide, heat the mixed solution to 100°C, stir evenly and then impregnate in step (1) to obtain reinforced fiber;

[0032] Step (3) placing the impregnated reinforcing fiber obtained in step (2) in a drying oven, drying at 120° C. for 5 hours, removing the solvent, and obtaining a prepreg;

[0033] Step (4) Lay up the prepregs obtained in step (3) neatly, place them in a steel plate mold and place them on a hot-pressing platform, set the temperature of the hot-pressing platform to 200°C, apply pressure slowly to remove air bubbles, and maintain the pressure 20MP, maintain temperature and pressure for 2 hours;

[0034] Step (5) After step (4) is solidified and naturally cooled to room te...

Embodiment 3

[0037] Step (1) Dissolve 2.5g of polyarylether nitrile in 10ml of N-methylpyrrolidone, apply it evenly on the surface of glass fiber cloth, and obtain reinforcing fiber after drying;

[0038] Step (2) Mix 50g of nitrile resin prepolymer with 3.5g of curing agent and dissolve in N,N-dimethylformamide, heat the mixed solution to 100°C, stir evenly and impregnate in step (1) to obtain reinforced fiber;

[0039] Step (3) placing the impregnated reinforcing fiber obtained in step (2) in a drying oven, drying at 120° C. for 5 hours, removing the solvent, and obtaining a prepreg;

[0040] Step (4) Lay up the prepregs obtained in step (3) neatly, place them in a steel plate mold and place them on a hot-pressing platform, set the temperature of the hot-pressing platform to 200°C, apply pressure slowly to remove air bubbles, and maintain the pressure 15MP, maintain temperature and pressure for 2 hours;

[0041] Step (5) After step (4) is solidified and naturally cooled to room tempera...

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Abstract

The present invention involves a preparation technology for high -temperature -resistant copper -covered copper plate materials that required for the preparation of the preparation technology include homemade cymbal resin prefabricated, polyford ether polymer and curing agent. First, apply the polyford ether sink solution to the surface of the glass fiber evenly to prepare the enhanced fiber; secondly, mix the homemade cymbal resin premature and curing agent 1: (0.05 ~ 0.2) Liquid, impregnation to enhance fibrous preparation of immersion, and then prepare resin bases to enhance fibrous composite plates through the thermal pressure of the mold. Finally, by adjusting the proportion of cymbal resin prefabrication to curing agent, a series of copper -covering plates with different bending strength, modulus, glassization transformation temperature, heat resistance and dielectric characteristics can be obtained after temperature treatment. The curved strength of this material is 620MPa ~ 680MPa, the curved modulus is 27GPa to 34GPa, the glass transformation temperature is 280 ° C to 300 ° C, and the dielectric constant of the fiber enhanced composite plate is 4.5 to 4.7. The preparation technology of this copper -covered material is a high -molecular technology processing field, which can be used as enhanced composite materials in the field of printing line substrate technology.

Description

technical field [0001] The invention relates to the preparation and processing technology of a resin-based fiber-reinforced composite material, which belongs to the field of polymer technology processing and can be used as a high-temperature-resistant copper-clad laminate in the technical field of printed circuit boards. Background technique [0002] Printed Circuit Board (PCB for short) refers to an insulating substrate with conductive lines on the surface or inside. It is the most critical part of portable electronic products, satellite transmission and communication products. It is an important material for connecting and supporting electronic devices. It is an indispensable main component of many electronic products. Its performance will directly affect the performance of electronic products. . Copper Clad Laminate (CCL for short) is the mainstream basic material for manufacturing PCBs. It is formed by coating resin on the surface of reinforcing materials such as glass ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C70/42B29C70/54B29B15/14
CPCB29B15/14B29C70/42B29C70/54
Inventor 徐明珍任登勋李逵陈林袁悦杨雨辰刘孝波
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA