Curable resin composition, composition for molding, resin molded article, and method for producing resin molded article

A technology of curable resins and resin moldings, applied in the field of curable resin compositions, can solve problems such as easy cracking and brittle moldings, achieve high elongation at break, improve shape recovery speed, stress relaxation and water resistance excellent effect

Inactive Publication Date: 2018-04-17
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One method of increasing the strength of a resin molded article is to form a three-dimensional cross-linked structure, but according to this method, although the hardness is increased, the molded article tends to be brittle and easily cracked

Method used

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  • Curable resin composition, composition for molding, resin molded article, and method for producing resin molded article
  • Curable resin composition, composition for molding, resin molded article, and method for producing resin molded article
  • Curable resin composition, composition for molding, resin molded article, and method for producing resin molded article

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0142] Hereinafter, an Example is given and this invention is demonstrated further concretely. However, the present invention is not limited to these Examples.

[0143] (curable resin composition)

[0144] 1. Synthesis of Polymers Containing Polyoxyalkylene Chains (Modification Polymers)

[0145] Polymer 1

[0146] After adding diol in the amount (mg) shown in Table 1 to a 20 mL round bottom flask, the inside of the flask was replaced with nitrogen, and the contents were melted at 115°C. 4,4'-Dicyclohexylmethane diisocyanate (262 mg, 1.00 mmol) was added to the molten liquid, and stirred at 115°C for 24 hours under a nitrogen atmosphere to obtain Polymer 1 containing a polyoxypropylene chain.

[0147] A GPC chromatogram of the obtained polymer was obtained at a flow rate of 1 mL / min using DMF (N,N-dimethylformamide) containing 10 mM lithium bromide as an eluent. From the obtained chromatogram, the number average molecular weight Mn of the polymer was determined as a value ...

Synthetic example 1

[0171] Synthesis Example 1: Synthesis of trans-1,2-bis(2-acryloyloxyethylcarbamoyloxy)cyclohexane (BACH)

[0172] Trans-1,2-cyclohexanediol (2.32 g, 20.0 mmol) was placed in a 100 mL two-necked round-bottom flask, and the inside of the flask was replaced with nitrogen. Dichloromethane (40 mL), and dibutyltin dilaurate (11.8 μL, 0.10 mol%: 0.020 mmol) were added thereto. A solution of 2-acryloyloxyethyl isocyanate (5.93 g, 42.0 mmol) in dichloromethane (4 mL) was added dropwise to the reaction solution in the flask from a dropping funnel, and the reaction solution was stirred at 30° C. for 24 hours to carry out reaction. After the reaction was completed, diethyl ether was added to the reaction liquid and washed with saturated brine. After the organic layer was dried over anhydrous magnesium sulfate, the solvent was distilled off under reduced pressure, and a solution containing the target compound was isolated from the residue by silica gel chromatography (elution solvent: ch...

Synthetic example 2

[0174] Synthesis Example 2: Synthesis of PEG-PPG Oligomer 1

[0175] After adding polyethylene glycol (PEG1500, 750 mg, 0.500 mmol, number average molecular weight of 1500) and polypropylene glycol (PPG4000, 2000 mg, 0.500 mmol, number average molecular weight of 4000) into a 20 mL round bottom flask, nitrogen Substitute, allowing the contents to melt at 115°C. 4,4'-Dicyclohexylmethane diisocyanate (262 mg, 1.00 mmol) was added to the molten liquid, and the molten liquid was stirred at 115° C. for 24 hours under a nitrogen atmosphere to obtain PEG-PPG oligomer 1 (containing polyoxygen ethylene chain, and the second polymer of polyoxypropylene chain).

[0176] The weight average molecular weight (Mw) of the obtained oligomer 1 was 9300, and the weight average molecular weight / number average molecular weight (Mw / Mn) of the oligomer 1 was 1.65.

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Abstract

Disclosed is a curable resin composition containing a radical-polymerizable monomer that contains a monofunctional radical polymerizable monomer, a linear or branched polymer that contains a polyoxyalkylene chain, and a radical polymerization initiator.

Description

technical field [0001] The present invention relates to a curable resin composition, a molding composition, a resin molded article, and a method for producing a resin molded article. Background technique [0002] Regarding resin molded articles, materials having excellent mechanical properties such as hardness that is hardly deformed, strength that does not break even if deformed, and flexibility have been sought. One method of increasing the strength of a resin molded article is to form a three-dimensional crosslinked structure. According to this method, although the hardness is increased, the molded article tends to be brittle and easily cracked. [0003] As a method of improving strength and flexibility, for example, a method of dispersing an easily deformable elastomer component such as acrylic rubber in a resin to relax stress is generally known. In addition, it is also known that the strength of a resin molded article is also improved by adding a high molecular weight...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F2/44C08J5/00
CPCC08G18/4825C08G18/4833C08G18/4837C08G18/758C08G18/8116C08G18/8175C08F283/006C08G18/3212C08G18/4808C08F2/50C08F283/06C08F2810/20C08G2280/00C08L33/06C08L71/02C08L33/14C08F220/1808C08F220/1812C08F220/44C08F222/225C08F222/102C08F220/281C08F2/44C08G18/48C08F20/18C08F20/44C08F20/54C08G18/8125C08J3/246
Inventor 白坂敏明横山耕祐竹内一雅落合文吾千叶一生桐生智成
Owner RESONAC CORPORATION
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