Noise reduction ultrasonic rotary microchannel heat exchanger for data room

Abstract

The invention discloses a noise reduction type ultrasonic rotation micro-channel heat exchanger for a data machine room. The heat exchanger comprises a heat exchange housing, a cooling water channel,a micro-finned tube assembly, an ultrasonic generator and an ultrasonic transducer, the heat exchange housing is arranged on a heat sink of a server host in the data machine room, the ultrasonic transducer is arranged on an outer wall of the heat exchange housing, the micro-finned tube assembly comprises a micro-finned tube shaft, micro-finned tubes and a driving device, the micro-finned tube shaft is arranged at the central axis of the heat exchange housing, the micro-finned tube shaft can be driven to rotate by the driving device, the micro-finned tubes are uniformly arranged on the micro-finned tube shaft in the heat exchange casing, the distance between each two adjacent micro-finned tubes along the axial direction of the micro-finned tube shaft is Da, the distance between each two adjacent micro-finned tubes along the circumferential direction of the micro-finned tube shaft is Dc, the ratio of Da to Dc is 1-2, and portions between the micro-finned tubes and the micro-finned tube shaft and an inner wall of the heat exchange housing form the cooling water channel. According to the heat exchanger, the heat exchange efficiency is high, descaling can be realized, and the formationof dirt can be thoroughly suppressed.

Description

technical field [0001] The invention relates to the fields of energy saving and refrigeration, in particular to a noise-reducing ultrasonic rotary micro-channel heat exchanger for a data machine room. Background technique [0002] The field of microelectronics is an engineering field that deals with flow and heat transfer problems at the microscale. With the development of integration technology and microelectronic packaging technology, the total power density of electronic components continues to increase, while the physical size of electronic components and electronic equipment tends to be smaller and miniaturized, and the heat generated accumulates rapidly, resulting in micro The heat flux around the components is also increasing rapidly, and the resulting high temperature will definitely affect the performance of electronic components and equipment, such as reducing the working stability of the chip and increasing the error rate. The resulting thermal stress will direct...

AI Technical Summary

Problems solved by technology

[0003] At present, when exchanging heat with existing micro-components, there is usually the problem of low heat exchange efficiency. In addition, the flow resistance of cooling water in micro-channels is relatively large, and the cavitation effect of ultrasonic waves cannot fundamentally solve the problem of descaling. question

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