Cooling device with embedded hot pipe and manufacturing method of cooling device

Abstract

The invention relates to a cooling device with an embedded hot pipe. The cooling device comprises a heat sink and a hot pipe, wherein a groove is formed in a bottom surface of the heat sink, an opening direction of the groove faces a surface, connected with a heat generation chip, of the heat sink, one end of the hot pipe is arranged in the groove, a part of a surface of the hot pipe is exposed out of the groove and can be in contact with the heat generation chip, and the hot pipe exposed out of the groove is flush with a bottom surface of the heat sink. In the device, the hot pipe is in direct with the heat generation chip; and compared with an existing hot pipe inserted into the heat sink, the heat resistance between the heat generation chip and the hot pipe can be effectively reduced. The fabrication method comprises the steps of a) sintering and annealing the hot pipe to obtain a soft hot pipe; and b) forming the groove in the bottom surface of the heat sink, coating heat conduction paste in the groove, placing one end of the hot pipe in the grove, and allowing the other end of the hot pipe to penetrate through a plurality of through holes in fins and be closely matched with the through holes. According to the manufacturing method of the device, the cooling device of which the heat generation chip is in direct contact with the hot pipe can be obtained, the sunken problem generated when the hot pipe is pressed is eliminated, and meanwhile, the pressed hot pipe is more closely contacted with the groove.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic components, in particular to a heat pipe embedded heat dissipation device and a manufacturing method thereof. Background technique [0002] With the rapid development of electronic technology, the computing power of electronic components is getting stronger and stronger, and the heat generated during computing is also getting higher and higher, and the service life of electronic components is shortened rapidly with the increase of operating temperature. To operate stably at low temperature, the heat generated needs to be dissipated in time. In addition, the rapid development of the electronics industry has also continuously promoted the development of high-efficiency heat dissipation devices: from heat sinks with fins to heat dissipation modules using heat pipes. Therefore, an efficient heat dissipation device is the basis for the full performance of electronic components. [0003] ...

AI Technical Summary

Problems solved by technology

The heating chip 4 of this device is not in direct contact with the heat pipe 2, and the thermal resistance is relatively large, which is not conducive to heat conduction

Images