Heat dissipation device

A heat dissipation device and heat sink technology, which is applied in identification devices, cooling/ventilation/heating transformation, instruments, etc., can solve problems such as uneven heat dissipation, chip performance degradation, and chips that cannot quickly dissipate heat, and achieve the effect of improving heat dissipation efficiency
CN107969099APending Publication Date: 2018-04-27SHENZHEN DICOLOR OPTOELECTRONICS
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN DICOLOR OPTOELECTRONICS
Publication Date
2018-04-27

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Abstract

The invention discloses a heat dissipation device. The heat dissipation device comprises a heat dissipation assembly and a circuit board which matches the heat dissipation assembly. The heat dissipation assembly comprises a heat conducting board and a number of first heat dissipation fins which are detachably connected with the heat conducting board. Adjacent first heat dissipation fins are arranged in parallel and are spaced apart from each other. The circuit board comprises a substrate, and a number of chip units arranged on the upper surface of the substrate. The lower bottom of the heat conducting board is close to the upper surface of a number of chips. According to the heat dissipation device in the structure, the first heat dissipation fins and the heat conducting board are in snapconnection; the number of the first heat dissipation fins can be flexibly adjusted according to the heat generation temperature of different chip units on the lower bottom of the heat conducting board; and the heat dissipation efficiency of the heat dissipation assembly can be effectively improved.
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Description

technical field

[0001] The invention relates to the technical field of LED display screens, in particular to a heat dissipation device. Background technique

[0002] With the vigorous development of high technology, electronic products are becoming more and more intelligent and complex, the volume of electronic components tends to be miniaturized, and the density per unit area is also getting higher and higher. The direct impact of this situation is that electronic products generate more and more heat during operation. If there is no good heat dissipation method to remove the heat generated by the electrons, these excessively high temperatures will lead to electron ionization and thermal stress in the electronic components, resulting in a decrease in overall stability and shortening the life of the electronic components themselves. Therefore, how to remove these heats to avoid overheating of electronic components has always been a problem that cannot be ignored.

[0003] D...

Claims

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