Encapsulation structure and manufacturing method thereof

Abstract

The invention relates to a packaging structure and a manufacturing method thereof. The packaging structure comprises a circuit substrate, a first layer-adding line structure, a second layer-adding line structure, and a plurality of piezoelectric heat radiating units. The circuit substrate comprises a core layer, a plurality of electronic components, and a conducting unit. The electronic componentsare imbedded in the core layer, and the active surfaces of two adjacent electronic components respectively face towards the a first surface and a second surface of the core layer. The conducting unitis configured to the core layer and is electrically connected to the electronic components. The first and second layer-adding line structure are respectively configured to the first and second surface, and are respectively provided with at least one first opening and one second opening. Each piezoelectric heat radiating unit is corresponding to the active surface of the electronic component, andis electrically connected to the conducting unit, exposing from the first opening and the second opening. The invention is advantageous in that the electromagnetic wave interference among the electronic components can be prevented; the packaging is thin and volume can be small; the thin-type demand can be met.

Description

technical field [0001] The present invention relates to a packaging structure and a manufacturing method thereof, and in particular to a packaging structure with a heat dissipation function and a manufacturing method thereof. Background technique [0002] With the development of the technology industry, the electronic components in electronic products are also developing towards high performance, high speed and multi-function. However, these electronic components generate a large amount of heat energy during operation. Therefore, how to integrate the heat dissipation module design into the electronic device to reduce the heat generated by the electronic components has become one of the urgent problems to be solved. [0003] In the existing packaging structure, the piezoelectric material is attached to the inner side of the metal shielding cover, and the metal shielding cover is erected on the packaging carrier board to define an accommodating cavity with the packaging carrie...

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Problems solved by technology

[0004] The present invention provides a packaging structure, the active surfaces of two adjacent electronic components face opposite directions respectively, and the piezoelectric cooling unit is arranged in the opening of the layered circuit structure, which can effectively solve the problem of existing electronic components. The problem of electromagnetic interference, and can have a thinner package thickness and volume, in line with today's demand for thinner products

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