58results about How to "Meet the needs of thinning" patented technology

The invention belongs to the technical field of lithium ion batteries, and particularly relates to anode material. The anode material is formed by bulk phase material and surface material in a fusion mode, wherein the surface material is located on the surface of the bulk phase material, the bulk phase material is lithium cobalt oxide, the surface material is fusing granules which are composed of layered nickel lithium manganate, and the surface material accounts for 0.1-10% of the anode material by a mass percentage. Compared with the prior art, the anode material which is formed by the layered nickel lithium manganate is coated on the surface of the lithium cobalt oxide, due to the fact that the coating layer has good lithium-ion conduction performance, not only is a discharge voltage platform of the anode material not reduced and is the discharge voltage platform of the anode material increased on the contrary, but also the coating layer can play effective gram volume under high voltage, increase structural stability of base body material and accordingly improve the discharge capacity of the anode material under the high voltage and prolong the cycle life of the anode material significantly. In addition, the invention further discloses a preparation method of the anode material and a lithium ion battery comprising the anode material.

The invention discloses a lithium ion battery anode material and a preparation method of the lithium ion battery anode material, and also discloses a lithium ion battery using the anode material. The material comprises a melting structure formed by layered-layered-spinelle in an intergrowth manner, wherein layered lithium cobalt oxide is used as the inner layer; layered nickel lithium manganate is used as the middle layer; spinelle nickel lithium manganate is used as the outermost layer. The material is prepared in a way that a NiMn oxide is coated on the surface of a precursor Co3O4, and then is subjected to sintering with lithium salt in a mixing manner. Compared with the prior art, the lithium ion battery anode material in the intergrowth structure has higher discharge capacity and excellent cycle performance under high voltage.

The invention belongs to the technical field of lithium ion batteries, and particularly relates to a high-voltage anode material for a lithium ion battery. The anode material comprises a material A and a material B, wherein the material A has a core-shell structure, a core layer material is lithium cobalt oxide particles formed by primary particles, the median particle diameters D50 of the lithium cobalt oxide particles are 15-25 microns, and the structure formula of a core-shell material is LixNiyMnzPO4; the material B has a core-shell structure, the core layer material is the lithium cobalt oxide particles formed by secondary particles, and the median particle diameters D50 of the lithium cobalt oxide particles are is 3-9 microns; and the structure formula of the core-shell material is LiwAlpZrqO2, and the mass ratio of the material A to the material B is (0.1-10) to 1. Compared with the prior art, the high-voltage anode material for the lithium ion battery provided by the invention has the advantages that the large and small lithium cobalt oxide particles are combined reasonably, different core layer materials can be arranged on the surfaces of the lithium cobalt oxide particles, and the secondary particles are selected as the small lithium cobalt oxide particles, so that the cycle performance and the safety performance of the anode material under high voltage are notably improved.

The invention provides a chip packaging structure and a manufacture method thereof. The chip packaging structure comprises a first pin, a first conductive post positioned on the first pin, and a second pin positioned on a second conductive post and electrically connected with the second conductive post and a first electric connecting body on a chip active surface, wherein an electrode bonding pad on the chip active surface is led out through a conductive path comprising the first electric connecting body, the second pin, the first conductive post and the first pin, and finally the electric connection between a chip and an external circuit is realized through the first pin. The mode for leading out the electrode can effectively reduce packaging resistance, does not need solder for welding, can avoid the phenomenon of pseudo soldering, improves the chip packaging reliability, and effectively reduces the chip packaging thickness.

The invention relates to composite electrical contact equipment applicable for manufacturing thin silver layers. The composite electrical contact equipment comprises a wire incoming device for conveying copper wires and silver wires with different wire diameters, a shearing rod capable of moving back and forth to shear the wires provided by the wire incoming device so as to cut the silver wires and the copper wires, a die holder which is fixed on the equipment and corresponds to the shearing rod, a final upsetting die for molding the wires into electrical contact products, a cam transmission device for controlling each component of the equipment to perform coordinated actions and the like; a storage die for independently storing the sheared silver wires is arranged on the die holder; and a control die for transferring the silver wires in the storage die, carrying out stained connection pre-upsetting on the copper wires in the die holder and then molding into the electrical contact products by using the final upsetting die is arranged on the shearing rod. The composite electrical contact equipment has the beneficial effects that the defect that the junction surfaces of silver and copper are insufficient existing due to trimming on two sides of a bottom die in the prior art is overcome, and simultaneously the defect that the thinning capacity is insufficient in the prior art is also overcome.

A touch device comprises a touch panel and a shielding electrode film. The touch panel comprises a substrate and a touch element located on the substrate. The shielding electrode film is configured on the touch panel and is provided with a plurality of nanometer metal wires which are staggered to form the shielding electrode film. Therefore, the touch device can greatly reduce integral thickness. A touch display device with the structure is further provided.

The invention discloses a semiconductor packaging component with a cooling fan and a manufacturing method and a stacking structure thereof. The semiconductor packaging component with the cooling fan comprises a substrate, an electronic element, a packaging rubber body and a fan unit, wherein the substrate is provided with a first surface and a second surface, the first surface is provided with a fan arrangement area, the fan arrangement area of the substrate is provided with an open hole and a ventilation hole penetrating through the substrate; the electronic element is arranged on the first surface and around the fan arrangement area and is electrically connected with the substrate; the packaging rubber body is formed on the electronic element and the first surface of the substrate and is provided with a packaging rubber body opening for the exposure of the fan arrangement area; and the fan unit is arranged in the packaging rubber body opening and is electrically connected with the substrate. Since the electronic element is arranged on the part of the substrate outside the fan arrangement area, when the fan unit operates normally, heat produced by the electronic element can be effectively dissipated and can be prevented from being damaged as a result of overheating, and the overall height of the fan unit can be reduced.

The invention discloses a reflecting type electrochromic liquid crystal display (LCD) which comprises a first base plate, a second base plate, a first electrochromic liquid crystal mixture layer, a first electrode layer and a second electrode layer, wherein the second base plate is parallel to the first base plate, and the first electrochromic liquid crystal mixture layer is configured between the first base plate and the second base plate and comprises a plurality of liquid crystal molecules, an optical rotating agent and a macromolecule mixture; the liquid crystal molecules and the optical rotating agent are distributed in a curing structure of the macromolecule mixture; the first electrode layer is configured between the first base plate and the first electrochromic liquid crystal mixture layer, and the second electrode layer is configured between the second base plate and the first electrochromic liquid crystal mixture layer; the first electrochromic liquid crystal mixture layer reflects first reflecting light, and the wavelength of the first reflecting light is changed along with a first electric field between the first electrode layer and the second electrode layer.

The invention discloses an image module and a manufacturing method thereof. The image module comprises a lens assembly, an image sensing component, an anisotropic conductive adhesive and a circuit board. The circuit board possesses a first plate surface and a second plate surface. The image sensing component is arranged on the second plate surface. The lens assembly is arranged on the first plate surface. The anisotropic conductive adhesive is arranged between the second plate surface of the circuit board and the image sensing component so that the image sensing component is electrically connected to the circuit board. The manufacturing method of the image module comprises the following steps that the anisotropic conductive adhesive is coated on the second plate surface; thermal compression bonding processing is performed on the image sensing component and the anisotropic conductive adhesive so that the image sensing component is fixedly connected and electrically connected with the second plate surface; the lens assembly is arranged on the first plate surface and the image sensing component is packaged.

A support mechanism for movably supporting a lens, including a fixed module, a movable module, a lens holder and a resilient element. The movable module is movably disposed in the fixed module. The lens holder is movably disposed in the movable module for holding the lens. The resilient element is connected to an outer surface of the movable module and an inner surface of the fixed module, whereinthe outer surface faces the inner surface.

The invention relates to a packaging structure and a manufacturing method thereof. The packaging structure comprises a circuit substrate, a first layer-adding line structure, a second layer-adding line structure, and a plurality of piezoelectric heat radiating units. The circuit substrate comprises a core layer, a plurality of electronic components, and a conducting unit. The electronic componentsare imbedded in the core layer, and the active surfaces of two adjacent electronic components respectively face towards the a first surface and a second surface of the core layer. The conducting unitis configured to the core layer and is electrically connected to the electronic components. The first and second layer-adding line structure are respectively configured to the first and second surface, and are respectively provided with at least one first opening and one second opening. Each piezoelectric heat radiating unit is corresponding to the active surface of the electronic component, andis electrically connected to the conducting unit, exposing from the first opening and the second opening. The invention is advantageous in that the electromagnetic wave interference among the electronic components can be prevented; the packaging is thin and volume can be small; the thin-type demand can be met.

A semiconductor package comprises a packaging substrate; a plurality of semiconductor chips stacked on the packaging substrate in a stagger manner, forming an accommodation space between the packaging substrate and the stacked semiconductor chips; and a control chip integrated with the packaging substrate by flip chip technology and positioned in the accommodation space. As the control chip is arranged in the accommodation space, the thickness of the whole package is reduced so as to achieve the purpose of thinning.

The invention discloses an aphototropism mode and making method, wherein the aphototropism mode consists of frame and optical board, wherein the frame contains first material frame and second material frame; the second material frame is inserted in the first material frame; the strength of the second material is higher than the strength of first material; at least one joint part is formed between the first and second material frames; the optical board is set in the frame with part connecting at least one joint part.

The invention relates to a five-piece type high-pixel imaging lens, and the five-piece type high-pixel imaging lens is composed of five lenses. The five-piece type high-pixel imaging lens sequentially comprises a first lens with positive refraction power, a second lens with negative refraction power, a third lens with positive refraction power or negative refraction power, a fourth lens with positive refraction power and a fifth lens with negative refraction power from an object side to an image side, and meets the following relational expressions: ImgH/Fno is greater than 1.91, wherein ImgH is half of the length of a diagonal line of an effective imaging area of the five-piece type high-pixel imaging lens, and Fno is the aperture number of the five-piece type high-pixel imaging lens. The five-piece type high-pixel imaging lens is high in imaging quality and light and thin in size, and has a large aperture and a large field angle.

An embodiment of the present invention discloses a touch display panel and a driving method based on the touch display panel. The touch display panel may include a plurality of first conductors, a plurality of second conductors, and pixel units located at intersections of the first conductors and the second conductors. The pixel units are electrically connected to the first conductors and the second conductors. A first switch and a second switch are arranged on both ends of the first conductors in a first direction. A third switch and a fourth switch are arranged on both ends of the second conductors in a second direction. The first direction is perpendicular to the second direction, and the touch display panel is in a display state or a touch-sensing state in a time-sharing manner. The method can realize the multiplexing of the display and the touch of the first conductors and the second conductors, which not only reduces the process complexity and cost of the touch display panel, butalso meets the demand for thinning of the touch display panel.

The invention provides a continuous hot galvanizing process of an ultra-thin galvanized substrate for color coating, which is characterized in that according to bottleneck links of production and quality of the ultra-thin galvanized substrate (less than or equal to 0.3 mm) for color coating, a process of welding, annealing, galvanizing, finishing, withdrawing and straightening and curling is formulated; the production, surface and appearance quality problems of poor welding, wrinkles, wave shapes, strip breakage and the like of ultra-thin specifications are effectively controlled, and the product quality is greatly improved. Through effective cooperation of tension of all sections, accidents such as deviation, narrowing and breakage of the ultra-thin steel strip are effectively eradicated, and the high-speed and constant-speed production stability of the ultra-thin steel strip is ensured. An incomplete low-temperature annealing process is adopted, the annealed structure is a semi-fibrous structure, and the hardness, the strength and the toughness meet the use requirements of customers on strength improvement and thinning of the color-coated sheet.