59results about How to "Meet the needs of thinning" patented technology

The invention provides a reflection layer. The reflection layer comprises a plurality of groups of first dielectric films and a plurality of groups of second dielectric films, wherein the dielectric films and the second dielectric films are stacked alternatively; the refractive indexes of the first dielectric films are greater than those of the second dielectric films. The invention also provides a backlight module, comprising a light guide plate, a light source and a reflection layer. According to the backlight module provided by the invention, the light guide plate is made of glass so as to have relatively high hardness, the whole backlight module does not need to be supported by an additional backing plate, so that backlight energy consumption is saved, and the thinning demand can be met; furthermore, a reflector plate is formed by stacking multiple layers of dielectric films with different refractive indexes, so that the reflectivity is greatly promoted, the light emission efficiency of the backlight module is improved, and the reliability and the scraping resistance of the backlight module are improved; meanwhile, as the reflectivity of the reflection layer is very high, the back surface of the backlight module can be used as a mirror, so that the purpose of one screen with multiple functions can be achieved.

A support mechanism for movably supporting a lens, including a fixed module, a movable module, a lens holder and a resilient element. The movable module is movably disposed in the fixed module. The lens holder is movably disposed in the movable module for holding the lens. The resilient element is connected to an outer surface of the movable module and an inner surface of the fixed module, whereinthe outer surface faces the inner surface.

The invention discloses an aphototropism mode and making method, wherein the aphototropism mode consists of frame and optical board, wherein the frame contains first material frame and second material frame; the second material frame is inserted in the first material frame; the strength of the second material is higher than the strength of first material; at least one joint part is formed between the first and second material frames; the optical board is set in the frame with part connecting at least one joint part.

The invention discloses a semiconductor packaging component with a cooling fan and a manufacturing method and a stacking structure thereof. The semiconductor packaging component with the cooling fan comprises a substrate, an electronic element, a packaging rubber body and a fan unit, wherein the substrate is provided with a first surface and a second surface, the first surface is provided with a fan arrangement area, the fan arrangement area of the substrate is provided with an open hole and a ventilation hole penetrating through the substrate; the electronic element is arranged on the first surface and around the fan arrangement area and is electrically connected with the substrate; the packaging rubber body is formed on the electronic element and the first surface of the substrate and is provided with a packaging rubber body opening for the exposure of the fan arrangement area; and the fan unit is arranged in the packaging rubber body opening and is electrically connected with the substrate. Since the electronic element is arranged on the part of the substrate outside the fan arrangement area, when the fan unit operates normally, heat produced by the electronic element can be effectively dissipated and can be prevented from being damaged as a result of overheating, and the overall height of the fan unit can be reduced.