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Side clamping rotating electroplating machine used for circuit board machining

A technology for circuit boards and electroplating machines, applied in the electrolysis process, electrolysis components, cells, etc., can solve the problems of small scouring range, reduced processing quality, uneven concentration of the solution on the surface of the workpiece, etc., to increase the uniform concentration and increase the promotion. with balancing effect

Inactive Publication Date: 2018-05-08
泉州市西决三维科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a side clamping rotary electroplating machine for circuit board processing, to solve the problem of the existing side clamping rotary electroplating machine for circuit board processing when the circuit board is in the electroplating process. The scouring range of the plating solution on the surface of the plated parts is small, and sufficient contact and exchange cannot be carried out, and the concentration of the solution on the surface of the workpiece is uneven, which reduces the processing quality

Method used

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  • Side clamping rotating electroplating machine used for circuit board machining
  • Side clamping rotating electroplating machine used for circuit board machining
  • Side clamping rotating electroplating machine used for circuit board machining

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Embodiment

[0025] see Figure 1 to Figure 3, the present invention provides a side-clamping rotary electroplating machine for circuit board processing. Substrate 6, protective cover 7, electric control box 8, the inner tank 2 is installed inside the main body 1 of the electroplating machine and is an integrated structure with the main body 1 of the electroplating machine, the bottom of the inner tank 2 is welded with the electroplating workbench 5, The central end of the electroplating workbench 5 is provided with a circuit board clamping and rotating drive mechanism 4, the top of the circuit board clamping and rotating drive mechanism 4 is connected to the rotating bracket 3, the top of the main body of the electroplating machine 1 is welded to the fixed substrate 6 and perpendicular to each other, the fixed substrate 6 is installed under the electroplating workbench 5 and parallel to the electroplating workbench 5, the electric control box 8 is fixedly installed on the fixed substrate ...

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Abstract

The invention discloses a side clamping rotating electroplating machine used for circuit board machining. The side clamping rotating electroplating machine used for circuit board machining structurally comprises an electroplating machine body, an inner groove, a rotating support, a circuit board clamping and rotating driving mechanism, an electroplating workbench, a fixed substrate, a protective housing and an electric control cabinet; and the inner groove is installed in the electroplating machine body and is integrated with the electroplating machine body. According to the side clamping rotating electroplating machine used for circuit board machining, a rotating motor is used for driving a main rotating shaft to rotate, and an electroplating bin is driven to ceaselessly rotate; and meanwhile, a motor is used for driving a screwing telescopic rod and a sliding rod piece on a driving rotating disk to work, so that circuit boards can be made to move in the electroplating bin direction and plating liquid can perform large range scouring and full contact exchanging on the surface of a plating piece ceaselessly, the concentration uniformity of a solution on the surface of a workpiece is improved, a transmission rod generates power to push a pushing rod, and the pushing intensity and the balance of the screwing telescopic rod are increased.

Description

technical field [0001] The invention relates to a side clamping rotary electroplating machine for circuit board processing, and belongs to the technical field of side clamping rotary electroplating machines for circuit board processing. Background technique [0002] Before there were no printed boards, the installation of electronic products was a time-consuming and labor-intensive industry. The more complicated the product line, the greater the workload spent on assembly work, and the higher the probability of quality accidents. This is because the installation of electronic products at this time is to manually insert many electronic components into the rivet holes of the installation board one by one, and then use the wires to compare the circuit diagram drawn on the paper, one solder joint and one solder joint. welded out. A simple radio has dozens of solder joints, and a complex radio has hundreds of solder joints. If it is a more complicated circuit, not only are the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/08C25D21/10C25D7/00
CPCC25D17/08C25D7/00C25D21/10
Inventor 刘清水
Owner 泉州市西决三维科技有限公司