motherboard module

Abstract

The invention provides a mainboard module, which comprises a housing, a mainboard, a first positioning piece, a second positioning piece and a positioning connecting rod, wherein the housing is provided with a bottom plate, the mainboard is located on the bottom plate, the first positioning piece is located inside the housing and connected to a first block of the mainboard, the second positioningpiece is located inside the housing and connected to a second block of the mainboard, the positioning connecting rod is connected between the first positioning piece and the second positioning piece and connected to a third block of the mainboard, and the third block is substantially located between the first block and the second block. The mainboard module can avoid a problem of collision which may possibly occurs in assembly of a connector and the mainboard due to warpage of the mainboard, and can avoid a problem that a connecting pin of the connector is mistakenly inserted, bent and damagedbecause of difficult alignment between the connector and an inserting slot in the mainboard due to warpage of the mainboard.

Description

technical field [0001] The present invention relates to a module, in particular to a motherboard module. Background technique [0002] Generally speaking, after the motherboard is processed, it may be slightly bent due to the intervention of external forces (direct heating of the motherboard body, thermal expansion and contraction, or excessive force during installation), and the microbending state will affect the motherboard. The strength of the structure, thereby reducing the service life of the motherboard. [0003] In addition, due to the microbend of the motherboard itself or the microbend and warpage caused by the intervention of external forces, the solder on the contacts on the motherboard may fall off, resulting in the inability of the two connected contacts inside the solder to be energized, and further An open circuit is formed, making it difficult for the main board to exert its desired effect, and destroying the structure of the whole main board. [0004] In a...

AI Technical Summary

Problems solved by technology

[0002] Generally speaking, after the motherboard is processed, it may be slightly bent due to the intervention of external forces (direct heating of the motherboard body, thermal expansion and contraction, or excessive force during installation), and the microbending state will affect the motherboard. The strength of the structure, thereby reducing the service life of the motherboard

[0003] In addition, due to the microbend of the motherboard itself or the microbend and warpage caused by the intervention of external forces, the solder on the contacts on the motherboard may fall off, resulting in the inability of the two connected contacts inside the solder to be energized, and further An open circuit is formed, making it difficult for the motherboard to perform its desired effect and destroying the structure of the entire motherboard

[0004] In addition, when the surface of the motherboard has large unevenness or the warpage of the motherboard body is serious, it will affect the subsequent assembly of components on it

For example, when the connector enters the chassis and is assembled on the main board, the warping of the main board will make it difficult for the connector to be positioned on the main board, which may cause collisions or may cause the pins of the connector to break due to wrong insertion. bending damage

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