Thermal insulation board coating layer

An insulation board and coating technology, applied in anti-corrosion coatings and other directions, can solve the problems of unavoidable cold and hot bridges, difficult construction, construction difficulties, etc., and achieve the benefits of structural design, enhanced thermal insulation effect, and resistance to sudden changes in ambient temperature differences. strong effect

Inactive Publication Date: 2018-07-20
ANHUI DEQUAN NEW BUILDING MATERIALS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These three insulation methods have their own advantages and disadvantages. The advantage of external wall insulation is that it can effectively avoid the generation of cold and heat bridges and effectively protect the main structure. However, its disadvantage is that it is relatively difficult to construct at present; The advantage is that the construction is relatively simple and the cost is low. However, its disadvantages are also obvious. It is difficult to avoid the generation of cold and heat bridges. The joint between the wall and the insulation layer is prone to condensation and mildew. The advantage of sandwich insulation is that its The requirements for thermal insulation materials, especially the strength requirements for thermal insulation materials are low, and the disadvantage is that the generation of cold and thermal bridges cannot be avoided, and the construction is difficult

Method used

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  • Thermal insulation board coating layer

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Effect test

Embodiment 1

[0031] A kind of thermal insulation board coating comprises the raw material of following parts:

[0032] 12 parts of rigid polyurethane foam, 15 parts of ultra-low density polyethylene, 10 parts of trichlorethylene, 5 parts of carboxymethyl chitosan, 11 parts of 3,4-dimethylpyrazolate, 15 parts of sodium aluminate, 10 parts of polyglycerol fatty acid ester, 12 parts of dicyclohexylcarbodiimide, 6 parts of 4-dimethylaminopyridine, 8 parts of p-toluenesulfonic acid, 15 parts of terpene resin, 8 parts of ammonium polyphosphate, triphosphate 7 parts of phenyl ester, 12 parts of polyamide modified phenolic epoxy resin, 13 parts of graphite milk, 23 parts of polytetrafluoroethylene, 5 parts of organic bismuth antioxidant, 12 parts of copper oxide powder, 3 parts of concentrated hydrochloric acid, 5 parts of silane , 4.5 parts of antioxidant additives, 11 parts of propylene pitch resin, 10 parts of alkaline solution, 6 parts of deionized water, and 5 parts of ethanol.

[0033] In t...

Embodiment 2

[0053] A kind of thermal insulation board coating comprises the raw material of following parts:

[0054] 16 parts of rigid polyurethane foam, 12 parts of ultra-low density polyethylene, 8 parts of trichlorethylene, 11 parts of carboxymethyl chitosan, 10 parts of 3,4-dimethylpyrazolate, 17 parts of sodium aluminate, 6 parts of polyglycerol fatty acid ester, 13 parts of dicyclohexylcarbodiimide, 14 parts of 4-dimethylaminopyridine, 11 parts of p-toluenesulfonic acid, 13 parts of terpene resin, 7 parts of ammonium polyphosphate, triphosphate 8 parts of phenyl ester, 10 parts of polyamide modified phenolic epoxy resin, 12 parts of graphite milk, 23 parts of polytetrafluoroethylene, 12 parts of organic bismuth antioxidant, 20 parts of copper oxide powder, 12 parts of concentrated hydrochloric acid, 10 parts of silane , 4 parts of antioxidant additives, 6 parts of propylene pitch resin, 11 parts of alkaline solution, 8 parts of deionized water, and 5 parts of ethanol.

[0055] In ...

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Abstract

The invention discloses a thermal insulation board coating layer, and relates to the technical field of thermal insulation board, wherein the thermal insulation board coating layer comprises the components: hard polyurethane foam, ultra low density polyethylene, trichloroethylene, carboxymethyl chitosan, 3,4-dimethylpyrazolate, sodium aluminate, polyglycerol fatty acid ester, dicyclohexylcarbodiimide, 4-dimethylaminopyridine, p-methylbenzene sulfonic acid, terpene resin, ammonium polyphosphate, triphenyl phosphate, polyamide modified phenolic epoxy resin, aquadag, polytetrafluoroethylene, an organic bismuth antioxidant, a copper oxide powder, concentrated hydrochloric acid, silane, an antioxidant auxiliary agent, propylene asphaltic resin, an alkali solution, deionized water, and ethanol.The thermal insulation board coating is safe and non-toxic, has the advantages of good heat preservation, high temperature resistance, low temperature resistance, strong environment temperature difference sudden change resistance, and corrosion resistance, and can directly coat the surface of a thermal insulation board; through the processing treatment technology, the thermal insulation board withbetter thermal insulation effect is obtained, all layers are combined closely in use, the structure is stable, the structure design is beneficial to weight reduction and material saving, and economicinput in thermal insulation problem is reduced, and the cost performance ratio is high.

Description

Technical field: [0001] The invention relates to the technical field of thermal insulation boards, in particular to a coating of thermal insulation boards. Background technique: [0002] Insulation board is easy to understand that it is a board for building insulation. It is made of polystyrene resin as raw material plus other raw and auxiliary materials and polymers. It is heated and mixed while injecting a catalyst, and then extruded and formed. Rigid foam plastic board has moisture-proof and waterproof properties, which can reduce the thickness of the building's outer protective structure, thereby increasing the indoor usable area. [0003] There are mainly three energy-saving methods for existing building envelope structures, namely, external thermal insulation of external walls, internal thermal insulation of external walls, and sandwich thermal insulation. These three thermal insulation methods have their own advantages and disadvantages. The advantage of external wal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D127/18C09D7/61C09D7/63C09D7/65C09D5/08
CPCC09D127/18C08K2003/2248C08K2003/323C08L2205/035C09D5/08C08L75/04C08L23/06C08L67/00C08L45/00C08L63/00C08L95/00C08K13/06C08K9/02C08K9/06C08K3/04C08K3/22C08K3/32
Inventor 王德全
Owner ANHUI DEQUAN NEW BUILDING MATERIALS TECH CO LTD
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