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Backscattered electrons (BSE) imaging using multi-beam tools

A technology of backscattering electrons and backscattering, which is applied in the field of inspection systems and can solve problems such as the complexity of backscattered electron imaging

Active Publication Date: 2018-05-11
KLA TENCOR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it should also be noted that backscattered electron (BSE) imaging is complicated by the use of multiple focused electron beams
Therefore, BSE imaging is not supported by currently available multibeam SEMs

Method used

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  • Backscattered electrons (BSE) imaging using multi-beam tools
  • Backscattered electrons (BSE) imaging using multi-beam tools
  • Backscattered electrons (BSE) imaging using multi-beam tools

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Embodiment Construction

[0018] Reference will now be made in detail to the disclosed subject matter which is illustrated in the accompanying drawings.

[0019] Embodiments in accordance with the present invention relate to multi-beam scanning electron microscope (SEM) inspection systems and methods for controlling these inspection systems to support backscattered electron (BSE) imaging.

[0020] generally refer to figure 1 , an illustration depicting a simplified multi-beam SEM inspection system 100 is shown. The multi-beam SEM inspection system 100 may include an electron source 102 configured to deliver electrons toward a multi-beam aperture array 104 . Multi-beam aperture array 104 may define a plurality of apertures 106 (which may be arranged as a one-dimensional array or a two-dimensional array), which may be configured to generate a plurality of beamlets 108 from electrons provided by electron source 102 . A beamlet 108 may be delivered toward a target (e.g., a wafer) 110 to excite atoms in ...

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PUM

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Abstract

Multi-beam scanning electron microscope inspection systems are disclosed. A multi-beam scanning electron microscope inspection system may include an electron source and a beamlet control mechanism. The beamlet control mechanism may be configured to produce a plurality of beamlets utilizing electrons provided by the electron source and deliver one of the plurality of beamlets toward a target at a time instance. The multi-beam scanning electron microscope inspection system may also include a detector configured to produce an image of the target at least partially based on electrons backscatteredout of the target.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of U.S. Provisional Application No. 62 / 222,351, filed September 23, 2015, under 35 U.S.C. § 119(e). The entirety of said US Provisional Application No. 62 / 222,351 is hereby incorporated by reference herein. [0003] This application is related to co-pending and co-pending with KLA Tencor Corporation File No. P4779 and entitled "Multi-Beam Dark Field Imaging" and referring to Douglas Marshall Douglas Masnaghetti et al. are listed as inventors on US Patent Application No. (to be assigned), which is incorporated herein by reference in its entirety. technical field [0004] The present invention relates generally to the field of inspection systems, and more particularly to electron beam inspection systems. Background technique [0005] Thin polished plates such as silicon wafers and the like are a very important part of modern technology. For example, a wafer may refer to a thin shee...

Claims

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Application Information

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IPC IPC(8): H01L21/66
CPCH01J37/28H01J2237/2448H01J37/045H01J37/244H01J2237/24475H01J2237/0435H01J2237/057G03F1/86H01J37/3177H01J2237/221H01J2237/226H01J2237/2805H01L22/12H01L22/26H01L22/30
Inventor M·麦科德R·西蒙斯D·马斯纳盖蒂R·克尼彭迈耶
Owner KLA TENCOR CORP