Resistivity test device and test method for lithium tantalate and lithium niobate wafers

Abstract

A resistivity test device for lithium tantalate and lithium niobate wafers includes a first transparent plate, a second transparent plate, a first flexible annular ring and a second flexible annular ring. The first flexible annular ring is arranged on the inner side wall of the first transparent plate. The second flexible annular ring is arranged on the inner side wall of the second transparent plate. A first test liquid injection channel and a first exhaust channel are arranged inside the first transparent plate. A second test liquid injection channel and a second exhaust channel are arrangedinside the second transparent plate. In the invention, the two poles of a wafer under test are led out by putting the wafer under test in electrolyte, the wafer after test will not be damaged or affected, and the wafer can still be used as a finished product after cleaning. The test area of the wafer is limited by the first flexible annular ring and the second flexible annular ring, and the surface of the wafer will not be scratched or damaged. The two poles of the wafer are led out by inserting an electrode into electrolyte, there is no resistance loss, and the test precision is high.

Description

technical field [0001] The invention relates to the technical field of detecting lithium tantalate and lithium niobate wafers, in particular to a resistivity testing device and testing method for lithium tantalate and lithium niobate wafers. Background technique [0002] For lithium tantalate (LiTaO3), lithium niobate (LiNbO3) is a dielectric body, and the resistivity is between 107-1016Ω·cm. Usually, the resistivity is tested by drawing electrodes on both surfaces of the sample, and measuring the resistance with a high resistance meter. , using the ohmic resistance formula, the resistivity can be easily calculated. [0003] For hard and brittle materials such as LT and LN, the thickness is 0.5mm after being made into thin slices. The thickness is very thin and the brittleness is very high, which makes it very difficult to make electrodes on thin slices. A layer of metal conductive electrodes, and then detect the resistance, so the production of test samples requires coatin...

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Problems solved by technology

[0003] For hard and brittle materials such as LT and LN, the thickness is 0.5mm after being made into thin slices. The thickness is very thin and the brittleness is very high, which makes it very difficult to make electrodes on thin slices. A layer of metal conductive electrodes, and then detect the resistance, so the production of test samples requires coating equipment, not only the cost of coating is high, the coating cycle is very long, and the coated slices cannot be used as finished products, they can only be processed as waste, resulting in test costs The problem of high and long test cycle is not conducive to the development of test work in actual production

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