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Soft and hard flexible circuit board and manufacturing method thereof

A technology for flexible circuit boards and rigid circuit boards, which is used in multilayer circuit manufacturing, printed circuit manufacturing, printed circuits, etc. problems, to achieve the effect of improving the strength and service life, good electrical conductivity and low manufacturing cost

Pending Publication Date: 2018-05-18
深圳市世博通科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, due to the cumbersome and complicated manufacturing process of flexible and rigid circuit boards, it is difficult to improve the production quality, and it is difficult to eradicate various defects, such as: high manufacturing cost, insufficient overall flexibility, poor tear resistance and poor use effect, etc. there is a problem that needs to be solved

Method used

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  • Soft and hard flexible circuit board and manufacturing method thereof
  • Soft and hard flexible circuit board and manufacturing method thereof

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] like Figure 1 ~ Figure 2 Shown are the schematic diagram of the top view structure and the schematic diagram of the layered structure of the present invention, respectively.

[0025] A soft-rigid flexible circuit board 100, including a first flexible substrate 110, the surface of the first flexible substrate 110 is provided with a number of grooves 120 transversely, and a rigid circuit board 130 is installed in the groove 120, and the rigid circuit board 130 is provided with glue on the bottom surface of the groove 120, the surface of the first flexible substrate 110 is printed with a number of conductive lines connected with the rigid circuit board 130, and the surface of the rigid circuit board 130 is laser cut with installation grooves. A flexible pole piece 140 is installed in the installation groove, and the second flexible substrate 150 is hot-pressed on...

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Abstract

The invention relates to the technical field of flexible circuit boards, in particular to a soft and hard flexible circuit board and a manufacturing method thereof. The soft and hard flexible circuitboard comprises a first flexible substrate, several grooves are transversely formed in the surface of the first flexible substrate and are internally provided with hard circuit boards, one side of each hard circuit board is provided with adhesive glue adhering to the bottom face of the corresponding groove, several conducting circuits are printed on the surface of the first flexible substrate andare connected with the hard circuit boards, mounting grooves are subjected to laser cutting in the surfaces of the hard circuit boards, flexible electrode sheets are installed in the mounting grooves,second flexible substrates are subjected to hot-pressing on the side, away from the flexible electrode sheets, of the substrate, and connecting electrode sheets are arranged at the portions, corresponding to the flexible electrode sheets, of the second flexible substrates, and are connected with the flexible electrode sheets. The soft and hard flexible circuit board which is bonded by the hard circuit boards and the flexible substrates is adopted, the overall manufacturing cost is low, the using effect is good, a dual-layer flexible substrate is utilized, the overall flexibility is improved,the anti-tearing effect is improved, and the practicability is high.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a rigid-flex flexible circuit board and a manufacturing method thereof. Background technique [0002] With the development of electronic equipment, especially the development trend of electronic equipment such as mobile phones and digital cameras towards lightness, thinness, shortness and smallness, the only way to reduce the volume of finished products is to reduce parts or combine parts into modules. Realization, the characteristics of the soft-rigid circuit board just meet these requirements. It can effectively use the installation space, realize three-dimensional assembly, reduce installation costs, and can replace plug-ins, and can ensure reliability in shock, humidity and other environments. It has the characteristics of flexible boards, so due to its significant advantages, it has more and more application prospects, especially in aerospace and military fi...

Claims

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Application Information

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IPC IPC(8): H05K1/14H05K3/46
CPCH05K1/147H05K3/4691
Inventor 田超郭春余郭宝木郭世庭王学荣
Owner 深圳市世博通科技有限公司