Medical titanium-nickel-based hexahydric memory alloy
A memory alloy and titanium-nickel technology, which is applied in the field of medical titanium-nickel-based six-element memory alloy, can solve problems such as the inability to meet the needs of memory alloys, and achieve the effects of high cost performance, low operating temperature range and low cost.
Inactive Publication Date: 2018-05-25
西安赛特思迈钛业有限公司
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Problems solved by technology
[0003] The purpose of the present invention is to provide a medical titanium-nickel-based six-element memory alloy to solve the problem that the existing memory alloy cannot meet the medical needs of the body temperature narrow hysteresis memory alloy
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment 1
[0017] Using 0-grade sponge titanium Ti, 1-grade electrolytic nickel, electrolytic copper, aluminum-vanadium alloy, aluminum-silicon alloy as raw materials, the alloy ingot is made after induction melting. The atomic percentage of the alloy ingot is: Ti:50%, Ni:42 %, Cu: 6.2%, Al: 0.3%, V: 0.80%, Si: 0.2%, and the balance is impurities. The ingot is forged at 850°C, and forged into a square bar of about □50mm (that is, a square bar with a side length of 50mm in cross-section), and then rolled into a wire rod of Φ8±0.5mm through multiple passes at 880°C , and finally draw to Φ0.50 mm according to the requirements of use, and straighten to obtain the alloy wire of the present invention.
[0018] The measured tensile mechanical property parameters of the alloy at 30°C are:
[0019] Tensile strength Rm=760MPa; Yield strength Rp0.2=310MPa; Elongation A5=30.0%; Area shrinkage Z=40.0%;
[0020] Tensile strength Rm=770MPa; Yield strength Rp0.2=350MPa; Elongation A5=30.0%; Area reduc...
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Abstract
The invention discloses a medical titanium-nickel-based hexahydric memory alloy. The medical titanium-nickel-based hexahydric memory alloy at least comprises Ti, Ni, Cu, Al, V and Si, wherein the atomic percent of Ti is 50%, the atomic percent of Ni ranges from 40% to 45%, the atomic percent of Cu ranges from 4% to 9%, the atomic percent of Al ranges from 0.1% to 0.5%, the atomic percent of V ranges from 0.5% to 1.0%, and the atomic percent of Si ranges from 0.1% to 0.3%. On the basis of an existing TiNiCu and TiNiCuX series alloy, a certain amount of Al and V is added to reduce phase change temperature, a trace amount of Si is added, grains are refined, the plasticity is improved, and therefore the alloy has a lower use temperature interval and good machining performance; and meanwhile, the alloy is low in cost and high in cost performance, and meets the industrial requirement for a narrow-hysteresis titanium-nickel memory alloy with the body temperature of about 30 DEG C.
Description
【Technical field】 [0001] The invention belongs to the technical field of titanium-nickel alloys, in particular to a medical titanium-nickel-based six-element memory alloy. 【Background technique】 [0002] The TiNiCu shape memory alloy is developed on the basis of the TiNi alloy, and part of the Ni element is replaced by Cu, so that the phase transition hysteresis is significantly narrowed. Because when the Cu content is below 5at%, there is no hysteresis effect; when the Cu content is above 10at%, the alloy will become brittle and the machinability will be poor, so the TiNiCu alloy that has been used in industry has a ratio of Ti 50 Ni 50-x Cu x , (atomic percent) where X is 5-10, the phase transition hysteresis (As-Ms) is about 4°C, but the phase transition temperature Af of this alloy is around 70°C, and the TiNiCuCr low-temperature narrow hysteresis memory alloy on the market, due to Cr It has toxic effects on the human body, and the reduction of the phase transition te...
Claims
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Patent Timeline
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IPC IPC(8): C22C30/02C22C1/03C22F1/00
CPCC22C30/02C22C1/023C22C1/03C22C14/00C22C19/007C22C19/03C22F1/006
Inventor 杨晓康杨宏进毛江虹罗斌莉王海乔军伟
Owner 西安赛特思迈钛业有限公司