Temperature-measuring apparatus, inspection apparatus, and control method

Abstract

A temperature-measuring apparatus includes a heat source capable of changing a heat generation temperature, a temperature sensor that detects a temperature of a predetermined position other than a measurement target accommodated in a measurement subject, and a temperature computation portion that computes a temperature of the measurement target on the basis of heat balance characteristics of the temperature of the measurement target, a temperature of the heat source, and the temperature of the predetermined position, the temperature of the heat source, and the detected temperature of the predetermined position.

Description

technical field [0001] The present invention relates to a temperature measuring device and the like for measuring the internal temperature of a subject to be measured. Background technique [0002] In the manufacturing process of electronic components such as ICs (Integrated Circuits), in order to reduce initial defects and show reliability in advance, performance and function inspections (aging tests) of manufactured electronic components are performed. One has inspections at high temperatures. For example, Patent Document 1 discloses an electronic component inspection device that transports an electronic component to a socket for inputting and outputting electrical signals for inspection, presses the electronic component to the socket while heating the electronic component to connect their terminals, and inspects the electrical properties of the electronic component. characteristic. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2014-76519. [0004] However, ...

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Problems solved by technology

However, this conventional method cannot be applied to the case where the entire electronic component is regarded as a black box. Moreover, there may be errors in estimating the internal temperature of the entire electronic component from the operating state of the component, which may cause individual differences in the electronic component and peripheral differences. Due to fluctuations in the thermal environment, etc., deviations occur in the actual internal temperature, or sometimes it is impossible to heat electronic components to the target temperature, etc.

In addition, during the inspection period, it is necessary to set the internal temperature of the electronic component to the target temperature, but as a method of measuring the internal temperature of the electronic component, it may not be said that the conventional method has high accuracy.

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